公开(公告)号：US20090081370A1

公开(公告)日：2009-03-26

申请号：US11661237

申请日：2005-08-25

申请人： Christian Lowinski ,  Hans-Jurgen Schreier ,  Gerhard Steinberger ,  Jana Naumann

发明人： Christian Lowinski ,  Hans-Jurgen Schreier ,  Gerhard Steinberger ,  Jana Naumann

IPC分类号： B05D3/10

CPC分类号： C23C18/48 ,  C23C18/1844 ,  H05K3/244 ,  H05K2203/0392

摘要： The present invention relates to a method for depositing tin or tin alloy layers on substrates containing antimony compounds as flameproofing agents or for improving the stampability, wherein the antimony compound is removed from the surface of the substrate material by an acid solution prior to metallization. Particularly preferred, pretreatment solutions containing hydrochloric acids are used for this purpose. The method is particularly suitable for producing joinable tin final layers on printed circuit boards containing antimony compounds, the tin final layers being applied onto copper portions of the conductor pattern which are not covered by the solder stop mask.

摘要翻译： 本发明涉及一种用于在含有锑化合物作为防火剂的基材上沉积锡或锡合金层或提高冲压性的方法，其中在金属化之前通过酸溶液从基材表面除去锑化合物。 特别优选使用含有盐酸的预处理溶液用于此目的。 该方法特别适用于在含有锑化合物的印刷电路板上生产可接合的锡最终层，锡末端层被施加到未被阻焊掩模覆盖的导体图案的铜部分上。