Processor module mounting assembly and a method of use
    1.
    发明授权
    Processor module mounting assembly and a method of use 失效
    处理器模块安装组件和使用方法

    公开(公告)号:US07038914B2

    公开(公告)日:2006-05-02

    申请号:US10600127

    申请日:2003-06-20

    IPC分类号: H05K7/20

    摘要: A computer assembly is disclosed. The computer assembly comprises a chassis and a mounting module rigidly coupled to the chassis. The mounting module is for cooling the computer assembly when in operation. The computer assembly includes at least one circuit board suspended from the module. The at least one circuit board has a known orientation relative to the module and the at least one circuit board has a variable orientation relative to the chassis. A system and method in accordance with the present invention provides a stable mounting for the cooling system that includes a large heat sink. The method and system in accordance with the present invention prevents the disturbance of the critical alignment of the printed circuit board with the heatsink from shock and vibration loading. The system and method in accordance with the present invention provides features that ensure full and consistent engagement of the high density signal connectors, while preventing damage to these fragile components in installation and service. Finally, the system and method in accordance with the present invention provides a quick and easy means of assembly of the system, to enable secure reliable interconnection of the printed circuit board with the suspended circuit board (daughter board), while supporting the cooling system heatsink.

    摘要翻译: 公开了一种计算机组件。 计算机组件包括刚性地联接到底盘的底盘和安装模块。 安装模块用于在运行时冷却计算机组件。 该计算机组件包括至少一个从模块悬挂的电路板。 所述至少一个电路板相对于所述模块具有已知的取向,并且所述至少一个电路板相对于所述底盘具有可变的取向。 根据本发明的系统和方法为包括大型散热器的冷却系统提供了稳定的安装。 根据本发明的方法和系统防止印刷电路板与散热器的临界对准对冲击和振动负载的干扰。 根据本发明的系统和方法提供确保高密度信号连接器的完全和一致的接合的特征,同时防止在安装和服务中损坏这些易碎部件。 最后,根据本发明的系统和方法提供了一种快速和容易的组装装置的装置,以使印刷电路板与悬挂电路板(子板)的安全可靠互连,同时支持冷却系统散热器 。