Power distribution assembly with grounding feature
    1.
    发明授权
    Power distribution assembly with grounding feature 有权
    配电总成具有接地功能

    公开(公告)号:US07993150B1

    公开(公告)日:2011-08-09

    申请号:US12661221

    申请日:2010-03-12

    IPC分类号: H01R4/60

    CPC分类号: H01R4/66 H01R25/14

    摘要: A power distribution assembly (PDA) is provided with a support rail having a bendable grounding arm. This grounding arm extends from at least one axial end of the metal support rail and is bendable downwardly so as to overlie an end face of a power block on the PDA. The grounding arm includes a connector flange that projects inwardly through an access window formed in the power block, which connector flange is tight-fittingly engaged with an internal ground terminal upon insertion of the connector flange into the access window during downward bending of the grounding arm.

    摘要翻译: 配电组件(PDA)设置有具有可弯曲接地臂的支撑轨道。 该接地臂从金属支撑轨道的至少一个轴向端部延伸并且可向下弯曲,以覆盖PDA上的动力块的端面。 接地臂包括通过形成在动力块中的进入窗口向内突出的连接器凸缘,该连接器凸缘在接地臂向下弯曲期间将连接器凸缘插入接入窗口时与内部接地端子紧密地接合 。

    Flex connector and manufacturing process
    2.
    发明授权
    Flex connector and manufacturing process 有权
    Flex连接器和制造过程

    公开(公告)号:US07955106B1

    公开(公告)日:2011-06-07

    申请号:US12661220

    申请日:2010-03-12

    IPC分类号: H01R4/60

    摘要: A modular power distribution system includes power distribution assemblies and flex connectors. The flex connector includes end connector housings and a flexible jacket that encloses conductor wires extending between the connectors. The jacket is formed from superimposed layers of sheet-like jacket material that is flexible. The bottom jacket layer is first laid on a bottom housing section wherein conductors are then placed thereupon with an upper jacket layer then positioned over the bottom jacket layer. The top and bottom jacket layers have aligned free edges along at least one side thereof wherein the free edges are bonded together such as by heat sealing.

    摘要翻译: 模块化配电系统包括配电组件和柔性连接器。 柔性连接器包括端部连接器壳体和包围在连接器之间延伸的导线的柔性护套。 护套由柔软的片状护套材料的叠层形成。 首先将底部护套层放置在底部壳体部分上,然后将导体放置在其上,然后将上部护套层定位在底部护套层之上。 顶部和底部护套层沿其至少一个侧面具有对准的自由边缘,其中自由边缘例如通过热封接合在一起。