摘要:
An electronics housing system (S) adapted for electronic devices (D) includes a main chassis unit (M) and at least one removable module (10) mountable with the base unit (M) for supporting electronic circuitry components electro-optically coupled with the base unit (M). The removable module assembly (10) has a main body (12) that includes two opposing mounting edges (14, 16) and a connection edge (18). At least one of the mounting edges (14, 16) of the removable mounting assembly (10) has an opening (20) to receive a cooling air flow (F) into an interior cavity (22) of the main body (12) of the removable module (10). The main chassis (M) has a pair of opposing module mounting assemblies (24, 26) to receive a removable module (10) between the opposing module mounting assemblies (24, 26). The electronics rack wall (24, 26) includes a removable seal plate (32) to provide an air seal.
摘要:
An electronics housing system (S) adapted for electronic devices (D) includes a main chassis unit (M) and at least one removable module (10) mountable with the base unit (M) for supporting electronic circuitry components electro-optically coupled with the base unit (M). The removable module assembly (10) has a main body (12) that includes two opposing mounting edges (14, 16) and a connection edge (18). At least one of the mounting edges (14, 16) of the removable mounting assembly (10) has an opening (20) to receive a cooling air flow (F) into an interior cavity (22) of the main body (12) of the removable module (10). The main chassis (M) has a pair of opposing module mounting assemblies (24, 26) to receive a removable module (10) between the opposing module mounting assemblies (24, 26). The electronics rack wall (24, 26) includes a removable seal plate (32) to provide an air seal.