公开(公告)号：US20110292124A1

公开(公告)日：2011-12-01

申请号：US12788462

申请日：2010-05-27

申请人： Frank Edward Anderson ,  Richard Corley ,  Michael John Dixon ,  Jiandong Fang ,  Jeanne Mariee Saldanha Singh

发明人： Frank Edward Anderson ,  Richard Corley ,  Michael John Dixon ,  Jiandong Fang ,  Jeanne Mariee Saldanha Singh

IPC分类号： B41J2/135

CPC分类号： B41J2/1433 ,  B41J2/14 ,  B41J2/14072 ,  B41J2/1601 ,  B41J2/1623 ,  B41J2/1626 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1643 ,  B41J2002/14419 ,  B41J2002/14491 ,  B41J2202/20 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/10155 ,  H01L2924/00014

摘要： A micro-fluid ejection head has an ejection chip to expel fluid. It connects to a laminate construct. The construct has vertically configured wiring layers interspersed with non-conductive layers, such as carbon fiber layers. An upper of the wiring layers electrically connects to the ejection chip. The upper layer may also support a planar undersurface of the chip directly on a surface or in a recessed pocket. The two can connect with a die bond, such as one having silica or boron nitride. Fluid connections exist between ink feed slots of the chip and the laminate construct. A silicon tile or other material may also fluidly interconnect with the two. A plastic manifold optionally supports the laminate construct and may fluidly connect to it. The wiring layers of the laminate contemplate ground, power, and various bond pads. Other construct layers contemplate prepreg or core FR4 layers.

摘要翻译： 微流体喷射头具有排出流体的喷射芯片。 它连接到层压结构。 该构造具有垂直配置的布线层，其散布有诸如碳纤维层之类的非导电层。 布线层的上部电连接到排出芯片。 上层还可以直接在表面上或凹陷的口袋中支撑芯片的平面下表面。 两者可以与管芯接合，例如具有二氧化硅或氮化硼的管芯接合。 在芯片的供墨槽和层叠结构之间存在流体连接。 硅砖或其他材料也可以与两者流体互连。 塑料歧管任选地支撑层压结构并且可以流体地连接到它。 层叠体的布线层考虑地面，功率和各种接合垫。 其他构造层考虑了预浸料或核心FR4层。