公开(公告)号：US20080015728A1

公开(公告)日：2008-01-17

申请号：US11575706

申请日：2004-09-22

申请人： Daejin Kim ,  Jekil Ryu ,  HyunJung Kim

发明人： Daejin Kim ,  Jekil Ryu ,  HyunJung Kim

IPC分类号： G21K5/00 ,  G06F19/00

CPC分类号： G05B19/41865 ,  H01L21/67294 ,  H01L27/10844 ,  Y02P90/20

摘要： The present invention provides a system for processing a semiconductor substrate using a laser beam, the system including: a storing unit storing a process control data set for a slot for loading the semiconductor substrate therein; a process controlling unit detecting identification information of the slot in which the semiconductor substrate is loaded, and reading the control data, which is set for the detected identification information, from the storing unit to control a process of the semiconductor substrate; and a substrate processing unit processing the semiconductor substrate on the basis of the read control data using the laser beam with a predetermined energy.

摘要翻译： 本发明提供了一种使用激光束处理半导体衬底的系统，该系统包括：存储单元，用于存储用于将半导体衬底加载到其中的槽的过程控制数据组; 检测加载有半导体基板的槽的识别信息的处理控制单元，从存储单元读取对检测出的识别信息设定的控制数据，控制半导体基板的处理; 以及基板处理单元，其基于使用具有预定能量的激光束的读取控制数据来处理半导体基板。