公开(公告)号：US06221514B1

公开(公告)日：2001-04-24

申请号：US09385051

申请日：1999-08-30

申请人： Kevin Joseph Hawes ,  David Jay Vess ,  Dwadasi Hare Rama Sarma ,  Bradley Howard Carter ,  Jerome Anthony Schneider

发明人： Kevin Joseph Hawes ,  David Jay Vess ,  Dwadasi Hare Rama Sarma ,  Bradley Howard Carter ,  Jerome Anthony Schneider

IPC分类号： B32B1502

CPC分类号： H05K1/0265 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H05K1/09 ,  H05K3/1225 ,  H05K3/245 ,  H05K2201/0215 ,  H05K2203/043 ,  Y10S428/901 ,  Y10S428/931 ,  Y10T428/12014 ,  Y10T428/12708 ,  Y10T428/12715

摘要： A method by which a conventional circuit trace (14) is modified with a layer (16) of high-conductivity solder alloy to yield a high-current circuit trace (12) for high-current routing on a substrate (10). The method generally entails the use of a solder composition that contains a dispersion of metal particles (18) in a solder alloy (20). The metal particles (18) are selected on the basis of having a higher electrical conductivity than the solder alloy (20), and are present in sufficient amounts so that the electrical conductivity of the solder composition is significantly higher than that of the solder alloy (20). The solder composition is deposited on a conductor (14), and then reflowed to form a conductive layer (16) on the conductor (14). The metal particles (18) remain as a discrete dispersion within the conductive layer (16) in order to suitably promote the conductivity of the layer (16). The solder composition is preferably deposited in an amount sufficient to increase the current-carrying capacity of the resulting circuit trace (12) for high-current routing on the substrate (10), e.g., in excess of six amps.

摘要翻译： 常规电路迹线（14）用高导电性焊料合金的层（16）修饰以产生用于衬底（10）上的大电流布线的高电流电路迹线（12）的方法。 该方法通常需要使用包含金属颗粒（18）在焊料合金（20）中的分散体的焊料组合物。 基于具有比焊料合金（20）更高的导电性来选择金属颗粒（18），并且以足够的量存在，使得焊料组合物的电导率显着高于焊料合金的导电性（ 20）。 焊料组合物沉积在导体（14）上，然后回流以在导体（14）上形成导电层（16）。 为了适当地促进层（16）的导电性，金属颗粒（18）保持为导电层（16）内的离散分散体。 焊料组合物优选以足以增加所得到的电路迹线（12）的载流能力的量沉积，用于在衬底（10）上的高电流布线，例如超过6安培。