公开(公告)号：US08538572B2

公开(公告)日：2013-09-17

申请号：US12826564

申请日：2010-06-29

Applicant: Jiangxin Wang ,  Andrew James Perry ,  Vijayakumar C Venugopal

Inventor： Jiangxin Wang ,  Andrew James Perry ,  Vijayakumar C Venugopal

IPC: G06F19/00 ,  G05B13/02 ,  H01L21/00 ,  G06F15/00

CPC classification number: H01J37/32963 ,  H01J37/32935

Abstract: A method for automatically identifying an optimal endpoint algorithm for qualifying a process endpoint during substrate processing within a plasma processing system is provided. The method includes receiving sensor data from a plurality of sensors during substrate processing of at least one substrate within the plasma processing system, wherein the sensor data includes a plurality of signal streams from a plurality of sensor channels. The method also includes identifying an endpoint domain, wherein the endpoint domain is an approximate period within which the process endpoint is expected to occur. The method further includes analyzing the sensor data to generate a set of potential endpoint signatures. The method yet also includes converting the set of potential endpoint signatures into a set of optimal endpoint algorithms. The method yet further includes importing one optimal endpoint algorithm of the set of optimal endpoint algorithms into production environment.

Abstract translation: 提供了一种用于在等离子体处理系统内的衬底处理期间自动识别用于限定过程端点的最佳端点算法的方法。 该方法包括在等离子体处理系统内至少一个衬底的衬底处理期间从多个传感器接收传感器数据，其中传感器数据包括来自多个传感器通道的多个信号流。 该方法还包括识别端点域，其中端点域是期望发生过程端点的近似周期。 该方法还包括分析传感器数据以产生一组潜在的端点签名。 该方法还包括将潜在端点签名的集合转换成一组最优端点算法。 该方法还包括将一组最优端点算法的一个最优端点算法导入到生产环境中。

公开(公告)号：US20100330710A1

公开(公告)日：2010-12-30

申请号：US12826564

申请日：2010-06-29

Applicant: Jiangxin Wang ,  Andrew James Perry ,  Vijayakumar C. Venugopal

Inventor： Jiangxin Wang ,  Andrew James Perry ,  Vijayakumar C. Venugopal

IPC: H01L21/66 ,  G06F17/18

CPC classification number: H01J37/32963 ,  H01J37/32935

Abstract: A method for automatically identifying an optimal endpoint algorithm for qualifying a process endpoint during substrate processing within a plasma processing system is provided. The method includes receiving sensor data from a plurality of sensors during substrate processing of at least one substrate within the plasma processing system, wherein the sensor data includes a plurality of signal streams from a plurality of sensor channels. The method also includes identifying an endpoint domain, wherein the endpoint domain is an approximate period within which the process endpoint is expected to occur. The method further includes analyzing the sensor data to generate a set of potential endpoint signatures. The method yet also includes converting the set of potential endpoint signatures into a set of optimal endpoint algorithms. The method yet further includes importing one optimal endpoint algorithm of the set of optimal endpoint algorithms into production environment.

Abstract translation: 提供了一种用于在等离子体处理系统内的衬底处理期间自动识别用于限定过程端点的最佳端点算法的方法。 该方法包括在等离子体处理系统内的至少一个衬底的衬底处理期间从多个传感器接收传感器数据，其中传感器数据包括来自多个传感器通道的多个信号流。 该方法还包括识别端点域，其中端点域是期望发生过程端点的近似周期。 该方法还包括分析传感器数据以产生一组潜在的端点签名。 该方法还包括将潜在端点签名的集合转换成一组最优端点算法。 该方法还包括将一组最优端点算法的一个最优端点算法导入到生产环境中。