公开(公告)号：US20070278909A1

公开(公告)日：2007-12-06

申请号：US11446996

申请日：2006-06-05

申请人： Mo Xu ,  Johaan S.J. Koong

发明人： Mo Xu ,  Johaan S.J. Koong

IPC分类号： H02K11/00

CPC分类号： G11B25/043 ,  G11B33/025 ,  G11B33/1446 ,  G11B33/1493

摘要： Embodiments of the invention are directed to electronic device housings and may be particularly applicable to portable electronic devices. In an embodiment, an assembly comprises a first housing element that forms a first recess, a second housing element that contacts the first housing element, wherein the first recess faces away from the second housing element and the second recess faces towards the first housing element, wherein the first housing element and the second housing element combine to form an enclosure, and an electronic component within the enclosure. Embodiments of the invention increase shielding of electronic components within the housing and also reduce leakage paths through an interface between elements of the housing.

摘要翻译： 本发明的实施例涉及电子设备外壳，并且可以特别适用于便携式电子设备。 在一个实施例中，组件包括形成第一凹部的第一壳体元件，与第一壳体元件接触的第二壳体元件，其中第一凹槽背离第二壳体元件并且第二凹槽面向第一壳体元件， 其中所述第一壳体元件和所述第二壳体元件组合以形成外壳，以及所述外壳内的电子元件。 本发明的实施例增加了壳体内的电子部件的屏蔽，还减少了通过壳体的元件之间的界面的泄漏路径。