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公开(公告)号:US20230197638A1
公开(公告)日:2023-06-22
申请号:US17557565
申请日:2021-12-21
申请人: Mohammad Enamul KABIR , Keith ZAWADZKI , Shakul TANDON , Christopher M. PELTO , John Kevin TAYLOR , Babita DHAYAL
发明人: Mohammad Enamul KABIR , Keith ZAWADZKI , Shakul TANDON , Christopher M. PELTO , John Kevin TAYLOR , Babita DHAYAL
IPC分类号: H01L23/00 , H01L25/065 , H01L21/52
CPC分类号: H01L23/564 , H01L25/0655 , H01L21/52
摘要: Embodiments described herein may be related to apparatuses, processes, and techniques for a barrier that surrounds one or more dies which are electrically coupled with one or more electrical connections on a wafer. The barrier may be a hermetic barrier that is formed on a wafer prior to singulation to prevent moisture intrusion from a side of the wafer that may compromise the one or more electrical connections. Other embodiments may be described and/or claimed.