NON-CONTINUOUS BONDING OF SPUTTERING TARGET TO BACKING MATERIAL
    1.
    发明申请
    NON-CONTINUOUS BONDING OF SPUTTERING TARGET TO BACKING MATERIAL 有权
    溅射目标的非连续接合对材料

    公开(公告)号:US20130118898A1

    公开(公告)日:2013-05-16

    申请号:US13699311

    申请日:2011-05-23

    IPC分类号: C23C14/34

    CPC分类号: C23C14/3414 C23C14/3407

    摘要: A target assembly comprising—a support body having a carrying surface;—a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface,—wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.

    摘要翻译: 一种目标组件,包括:具有承载表面的支撑体; - 具有附接表面的溅射靶,所述承载表面和所述附接表面彼此相对地布置,从而在所述承载表面和所述 附着面 以及设置在所述中间空间中的用于将所述附接表面接合到所述承载表面的接合材料, - 在所述附接表面和所述承载表面中的一个或两个的不同区域被选择性地表面处理以增强所述接合材料的接合强度 在不同的地区。

    Non-continuous bonding of sputtering target to backing material

    公开(公告)号:US09932667B2

    公开(公告)日:2018-04-03

    申请号:US13699311

    申请日:2011-05-23

    IPC分类号: C23C14/34

    CPC分类号: C23C14/3414 C23C14/3407

    摘要: A target assembly comprising—a support body having a carrying surface; —a sputtering target having an attaching surface, said carrying surface and said attaching surface being arranged in opposing facing relation to one another, thereby defining an intermediate space between said carrying surface and said attaching surface; and—a bonding material disposed in the intermediate space for binding said attaching surface to said carrying surface, —wherein distinct areas of one or both of said attaching surface and said carrying surface are selectively, superficially treated to enhance the bonding strength of said bonding material in said distinct areas.