公开(公告)号：US07873394B2

公开(公告)日：2011-01-18

申请号：US10829066

申请日：2004-04-21

申请人： Frank Gong ,  Curt D. Croley ,  Joseph Garcia, Jr.

发明人： Frank Gong ,  Curt D. Croley ,  Joseph Garcia, Jr.

IPC分类号： H04M1/00 ,  H04B1/38

CPC分类号： H01H13/702 ,  B29C45/14639 ,  B29L2031/466 ,  H01H2207/004 ,  H01H2207/01 ,  H01H2217/033 ,  H01H2219/018 ,  H01H2219/039 ,  H01H2223/002 ,  H01H2229/048 ,  H01H2239/008 ,  H01H2239/048 ,  H01H2239/056

摘要： Systems and methodologies are provided for fabrication of a self contained key pad module having a top cover and a bottom cover. The top cover and the bottom cover encapsulate and/or sandwich a stack of keypad components via an over mold procedure that is performed around the stack. The packed stack between the top cover and the bottom cover can include a flex member, an electro luminous panel, and a silicone membrane with a plurality of keys thereupon.

摘要翻译： 提供了用于制造具有顶盖和底盖的自包含键盘模块的系统和方法。 顶盖和底盖通过围绕堆叠执行的过模制程序封装和/或夹紧键盘组件堆叠。 顶盖和底盖之间的堆叠堆叠可以包括柔性构件，电发光面板和具有多个键的硅膜。