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公开(公告)号：US20080318030A1
公开(公告)日：2008-12-25
申请号：US12205267
申请日：2008-09-05
IPC分类号： B32B7/12
CPC分类号： H01L21/6835 , H01L51/0013 , H01L2221/68359 , H01L2221/68363 , H01L2221/68368 , H01L2924/0002 , H01L2924/19041 , Y10T428/26 , Y10T428/2839 , Y10T428/2848 , H01L2924/00
摘要： The present invention is directed to methods for transferring pre-formed electronic devices, such as transistors, resistors, capacitors, diodes, semiconductors, inductors, conductors, and dielectrics, and segments of materials, such as magnetic materials and crystalline materials onto a variety of receiving substrates using energetic beam transfer methods. Also provided is a consumable intermediate comprising a transfer substrate and a transfer material coated thereon, wherein the transfer material may be comprised of pre-formed electronic devices or magnetic materials and crystalline materials that may be transferred to a variety of receiving substrates. Aspects of the present invention may also be used to form multi-device electronic components such as sensor devices, electro-optical devices, communications devices, transmit-receive modules, and phased arrays using the consumable intermediates and transfer methods described herein.
摘要翻译： 本发明涉及用于将诸如晶体管，电阻器，电容器，二极管，半导体，电感器，导体和电介质的预成型电子器件和诸如磁性材料和结晶材料的材料段转移到各种 使用能量束传递方法接收衬底。 还提供了包括转印基材和涂覆在其上的转印材料的消耗性中间体，其中转印材料可以由预先形成的电子器件或磁性材料以及可以转移到各种接收基底的结晶材料构成。 本发明的各方面也可用于使用本文描述的可消耗的中间体和转移方法来形成诸如传感器装置，电光装置，通信装置，发射 - 接收模块和相控阵列的多装置电子部件。
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公开(公告)号：US07423286B2
公开(公告)日：2008-09-09
申请号：US10935461
申请日：2004-09-07
CPC分类号： H01L21/6835 , H01L51/0013 , H01L2221/68359 , H01L2221/68363 , H01L2221/68368 , H01L2924/0002 , H01L2924/19041 , Y10T428/26 , Y10T428/2839 , Y10T428/2848 , H01L2924/00
摘要： The present invention is directed to methods for transferring pre-formed electronic devices, such as transistors, resistors, capacitors, diodes, semiconductors, inductors, conductors, and dielectrics, and segments of materials, such as magnetic materials and crystalline materials onto a variety of receiving substrates using energetic beam transfer methods. Also provided is a consumable intermediate comprising a transfer substrate and a transfer material coated thereon, wherein the transfer material may be comprised of pre-formed electronic devices or magnetic materials and crystalline materials that may be transferred to a variety of receiving substrates. Aspects of the present invention may also be used to form multi-device electronic components such as sensor devices, electro-optical devices, communications devices, transmit-receive modules, and phased arrays using the consumable intermediates and transfer methods described herein.
摘要翻译： 本发明涉及用于将诸如晶体管，电阻器，电容器，二极管，半导体，电感器，导体和电介质的预成型电子器件和诸如磁性材料和结晶材料的材料段转移到各种 使用能量束传递方法接收衬底。 还提供了包括转印基材和涂覆在其上的转印材料的消耗性中间体，其中转印材料可以由预先形成的电子器件或磁性材料以及可以转移到各种接收基底的结晶材料构成。 本发明的各方面也可用于使用本文描述的可消耗的中间体和转移方法来形成诸如传感器装置，电光装置，通信装置，发射 - 接收模块和相控阵列的多装置电子部件。
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