Apparatus for catching byproducts in semiconductor device fabrication equipment

    公开(公告)号:US20060169411A1

    公开(公告)日:2006-08-03

    申请号:US11327408

    申请日:2006-01-09

    CPC classification number: C23C16/4412

    Abstract: An apparatus for catching byproducts in semiconductor device processing equipment is disposed in an exhaust line between a process chamber and a vacuum pump. The apparatus includes a cylindrical trap housing member, an upper cover and a lower cover covering the upper part and lower part of the trap housing, respectively, a heater disposed under the upper cover, first and second cooling plates disposed in the trap housing, a post spacing the cooling plates, apart and a cooling system for cooling respective portions of the apparatus. The cooling system includes a delivery pipe for supplying refrigerant, a discharge pipe for discharging the refrigerant from the apparatus, first cooling piping extending through each cooling plate and connected to the delivery and discharge pipes, and second cooling piping extending helically along the outer circumferential surface of the trap housing.

    Apparatus for catching byproducts in semiconductor device fabrication equipment
    2.
    发明授权
    Apparatus for catching byproducts in semiconductor device fabrication equipment 失效
    用于在半导体器件制造设备中捕获副产品的装置

    公开(公告)号:US07491292B2

    公开(公告)日:2009-02-17

    申请号:US11327408

    申请日:2006-01-09

    CPC classification number: C23C16/4412

    Abstract: An apparatus for catching byproducts in semiconductor device processing equipment is disposed in an exhaust line between a process chamber and a vacuum pump. The apparatus includes a cylindrical trap housing member, an upper cover and a lower cover covering the upper part and lower part of the trap housing, respectively, a heater disposed under the upper cover, first and second cooling plates disposed in the trap housing, a post spacing the cooling plates, apart and a cooling system for cooling respective portions of the apparatus. The cooling system includes a delivery pipe for supplying refrigerant, a discharge pipe for discharging the refrigerant from the apparatus, first cooling piping extending through each cooling plate and connected to the delivery and discharge pipes, and second cooling piping extending helically along the outer circumferential surface of the trap housing.

    Abstract translation: 在处理室和真空泵之间的排气管路中设置用于在半导体器件加工设备中捕获副产物的装置。 该装置包括圆柱形捕集器壳体构件,上盖和下盖,分别覆盖捕集器壳体的上部和下部,设置在上盖下方的加热器,设置在捕集器壳体中的第一和第二冷却板, 将间隔开的冷却板间隔开,并且冷却系统用于冷却设备的各个部分。 冷却系统包括用于供应制冷剂的输送管,用于从设备排出制冷剂的排出管,延伸穿过每个冷却板并连接到排出管的第一冷却管道,以及沿着外周表面螺旋地延伸的第二冷却管道 的陷阱外壳。

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