公开(公告)号：US4887974A

公开(公告)日：1989-12-19

申请号：US302515

申请日：1989-01-27

申请人： Yoshiaki Ichimura ,  Katumi Takegawa ,  Yoshinori Mizusawa ,  Mitsuo Komoto ,  Shoji Umesato

发明人： Yoshiaki Ichimura ,  Katumi Takegawa ,  Yoshinori Mizusawa ,  Mitsuo Komoto ,  Shoji Umesato

IPC分类号： H01R13/193 ,  H01R13/62

CPC分类号： H01R13/193

摘要： A top housing, which has formed therein arrays of first housing chambers and first pin insertion holes respectively communicating therewith, and a bottom housing, which has formed therein arrays of second housing chambers and second pin insertion holes respectively communicating therewith, are assembled together so that the corresponding first and second housing chambers intercommunicate. A socket contactor is housed across the corresponding first and second housing chambers. The top and bottom housings are held together by a frame so that they are slidable relative to each other. Terminal pins of an IC are inserted into the first housing chambers through the first pin insertion holes and pin conductors of a printed board are inserted into the second housing chambers through the second pin insertion holes. By sliding the top and bottom housings relative to each other, each socket contactor is bent, and by its spring force, the socket contactor is urged against the terminal pin and the pin conductor.