公开(公告)号：US20100116484A1

公开(公告)日：2010-05-13

申请号：US12608900

申请日：2009-10-29

申请人： Norio KOKUBO ,  Yasuhisa HIROSE ,  Kazuhiko KUSAKA ,  Keiichi NISHIKAWA ,  Takahiro MINATANI

发明人： Norio KOKUBO ,  Yasuhisa HIROSE ,  Kazuhiko KUSAKA ,  Keiichi NISHIKAWA ,  Takahiro MINATANI

IPC分类号： F25B29/00 ,  F28F27/02

CPC分类号： F25D17/02 ,  F25B29/00

摘要： The temperature control device comprises a heating pathway that heats and circulates the fluid in the temperature adjustment unit, a cooling pathway that cools and circulates the fluid in the temperature adjustment unit, a bypass pathway that circulates the fluid in the temperature adjustment unit without passing the fluid through the heating pathway and the cooling pathway, an adjustment means that adjusts a flow ratio of the fluid that is supplied from the heating pathway, cooling pathway, and bypass pathway to the temperature adjustment unit, and a flow means that flows the fluid in order to circulate the fluid, and wherein a heating unit for heating the fluid is arranged in the heating pathway, and the flow means is disposed downstream from the heating unit along at least one of the pathways for circulating the fluid.

摘要翻译： 温度控制装置包括加热和循环温度调节单元中的流体的加热通道，使温度调节单元中的流体冷却和循环的冷却通道，使温度调节单元中的流体循环的旁路通路， 通过加热路径和冷却路径的流体，调节装置，其调节从加热路径供应的流体的流量比，冷却通道和旁路通路到温度调节单元的流量;以及流动装置， 使流体循环，并且其中用于加热流体的加热单元布置在加热路径中，并且流动装置沿着用于循环流体的路径中的至少一个设置在加热单元的下游。