公开(公告)号：US08630093B2

公开(公告)日：2014-01-14

申请号：US13041064

申请日：2011-03-04

申请人： Kei Kadomoto ,  Daiki Kudo ,  Takeshi Nakamura ,  Hiroyuki Nakade

发明人： Kei Kadomoto ,  Daiki Kudo ,  Takeshi Nakamura ,  Hiroyuki Nakade

IPC分类号： H05K7/20

CPC分类号： H05K7/20

摘要： A semiconductor device is provided with a power module capable of supplying an alternate current to a load, while a direct current is supplied from a battery to the power module for conversion into the alternate current, a cooling member capable of radiating heat generated by the power module, and a mounting member, integrally formed with a spring portion protruding in part therefrom and having elasticity, which allows the power module to be mounted on the cooling member under a state where one surface of the power module is caused to face the cooling member and the spring portion is pressed against the other surface of the power module in opposition to the one surface thereof.

摘要翻译： 半导体器件具有能够向负载提供交流电流的电力模块，同时从电池向功率模块提供直流电流以转换为交流电流;冷却部件，其能够散发由电力产生的热量 模块和安装构件，其一体地形成有从其部分突出并具有弹性的弹簧部分，其允许在使功率模块的一个表面面对冷却构件的状态下将功率模块安装在冷却构件上 并且弹簧部分相对于其一个表面压靠在功率模块的另一个表面上。

公开(公告)号：US20110216507A1

公开(公告)日：2011-09-08

申请号：US13041064

申请日：2011-03-04

申请人： Kei Kadomoto ,  Daiki Kudo ,  Takeshi Nakamura ,  Hiroyuki Nakade

发明人： Kei Kadomoto ,  Daiki Kudo ,  Takeshi Nakamura ,  Hiroyuki Nakade

IPC分类号： H05K7/20

CPC分类号： H05K7/20

摘要： A semiconductor device is provided with a power module capable of supplying an alternate current to a load, while a direct current is supplied from a battery to the power module for conversion into the alternate current, a cooling member capable of radiating heat generated by the power module, and a mounting member, integrally formed with a spring portion protruding in part therefrom and having elasticity, which allows the power module to be mounted on the cooling member under a state where one surface of the power module is caused to face the cooling member and the spring portion is pressed against the other surface of the power module in opposition to the one surface thereof.

摘要翻译： 半导体器件具有能够向负载提供交流电流的电力模块，同时从电池向功率模块提供直流电流以转换为交流电流;冷却部件，其能够散发由电力产生的热量 模块和安装构件，其一体地形成有从其部分突出并具有弹性的弹簧部分，其允许在使功率模块的一个表面面对冷却构件的状态下将功率模块安装在冷却构件上 并且弹簧部分相对于其一个表面压靠在功率模块的另一个表面上。