摘要:
A piezoelectric vibrator has a vibrator piece and a frame integral with the vibrator piece. The frame is connected to one end of and surrounds the vibrator piece. A lid has a surface anodically bonded to a first surface of the frame. The lid has a recessed portion at a position disposed opposite to and confronting the vibrator piece. A base has a surface anodically bonded to a second surface of the frame opposite the first surface thereof. The base has a recessed portion at a position disposed opposite to and confronting the vibrator piece. A beveled portion is formed around a surface of one of the lid and the base which does not correspond to the anodically bonded surface thereof.
摘要:
The present invention provides a piezoelectric vibrator which can sufficiently minimize the fluctuation of the oscillation frequency or the resonance resistance value even when a large static external force is applied to a package of the piezoelectric vibrator, a manufacturing method thereof, and an oscillator and an electronic equipment provided with the piezoelectric vibrator. In a manufacturing method of piezoelectric vibrators which manufactures a plurality of piezoelectric vibrators by applying anodic bonding to three wafers which are overlapped to each other with the first wafer sandwiched between the second wafer and the third wafer, and cutting the overlapped wafers at given positions, the manufacturing method includes, before a bonding step in which the anodic bonding is performed, a vibrator piece frame forming step which integrally forms vibrator pieces and frames which are connected to one ends of the vibrator pieces and surround the vibrator pieces on the first wafer, a first recessed portion forming step which forms first recessed portions on a bonding surface side of the second wafer, a second recessed portion forming step which forms second recessed portions on a bonding surface side of the third wafer, and a groove forming step in which a plurality of grooves are formed in a non-bonding surface side of at least one of the second wafer and the third wafer at given positions.