公开(公告)号：US06515061B1

公开(公告)日：2003-02-04

申请号：US08958848

申请日：1997-10-28

申请人： Sushumna Iruvanti ,  Keith Scott Olsen ,  Krishna Gandhi Sachdev

发明人： Sushumna Iruvanti ,  Keith Scott Olsen ,  Krishna Gandhi Sachdev

IPC分类号： C08K308

CPC分类号： C08K3/01 ,  C08L67/00

摘要： A paste composition having a high thermal conductivity and a relatively low viscosity is used to provide a thermal conductive connection between an electronic component and a cooling device to increase the heat transfer rate between the component and the device cooling the electronic component. The paste composition comprises a non-aqueous dielectric carrier, thermally conductive filler particles and a specially defined dispersant comprising the self-condensation reaction product of a hydroxy fatty acid, the reaction product having an acid number of about 30-100. A 12-hydroxy stearic acid self condensed reaction product is the preferred dispersant.

摘要翻译： 使用具有高热导率和较低粘度的糊剂组合物来提供电子部件和冷却装置之间的导热连接，以增加部件和冷却电子部件的装置之间的传热速率。 糊状组合物包含非水介电载体，导热填料颗粒和特别限定的分散剂，其包含羟基脂肪酸的自缩合反应产物，该反应产物的酸值为约30-100。 12-羟基硬脂酸自缩合反应产物是优选的分散剂。