公开(公告)号：US07220377B2

公开(公告)日：2007-05-22

申请号：US10758420

申请日：2004-01-16

申请人： Masaru Nikaido ,  Satoshi Ishikawa ,  Kentarou Shimayama

发明人： Masaru Nikaido ,  Satoshi Ishikawa ,  Kentarou Shimayama

IPC分类号： B29C33/60 ,  H01J1/00

CPC分类号： H01J29/028 ,  H01J9/185 ,  H01J9/242 ,  H01J31/127 ,  H01J2329/863 ,  H01J2329/864

摘要： A spacer assembly has first and second spacers that are set up integrally on first and second surfaces, respectively, of a substrate. Each spacer is tapered toward its extended end. In forming the spacer assembly, first and second molding dies having through holes coated with a parting agent that contains an organic component are prepared, and these molding dies are located on the first and second surfaces of the substrate so as to be intimately in contact with them, individually. Thereafter, a spacer forming material is filled into the through holes of the molding dies and cured, whereupon the first and second spacers are formed integrally on the substrate surfaces.

摘要翻译： 间隔件组件具有分别一体地设置在基板的第一和第二表面上的第一和第二间隔件。 每个间隔物朝向其延伸端逐渐变细。 在形成间隔件组件时，制备具有涂覆有分散剂的通孔的第一和第二模具，该模具包含有机组分，并且这些模具位于基材的第一和第二表面上以便与 他们，个别。 此后，将间隔物形成材料填充到模具的通孔中并固化，于是第一和第二间隔件一体地形成在基板表面上。