System and method for mapping logical components to physical locations in an integrated circuit design environment
    2.
    发明申请
    System and method for mapping logical components to physical locations in an integrated circuit design environment 有权
    将逻辑组件映射到集成电路设计环境中的物理位置的系统和方法

    公开(公告)号:US20050138595A1

    公开(公告)日:2005-06-23

    申请号:US10740284

    申请日:2003-12-18

    IPC分类号: G06F17/50

    CPC分类号: G06F17/5072

    摘要: A system and method for mapping IP components onto a pre-fabricated chip slice allows a user to select a target location for placement of an IP component onto a slice. A slice definition of the pre-fabricated chip slice is searched for a legal location for the IP component that is near to the target location. The IP component is mapped to the legal location.

    摘要翻译: 将IP组件映射到预制芯片片上的系统和方法允许用户选择用于将IP组件放置到片上的目标位置。 搜索预制芯片切片的切片定义,以获得靠近目标位置的IP组件的合法位置。 IP组件映射到合法位置。

    Chip design command processor
    3.
    发明申请
    Chip design command processor 审中-公开
    芯片设计指令处理器

    公开(公告)号:US20050114818A1

    公开(公告)日:2005-05-26

    申请号:US10719673

    申请日:2003-11-21

    IPC分类号: G06F9/44 G06F9/455

    CPC分类号: G06F9/45512

    摘要: A command processor of an integrated circuit design suite has a graphical user interface and a command interpreter for interpreting user commands. The graphical user interface is specified entirely by a user at run time. One or more design tools corresponding to processes within an integrated circuit design process operate under the control of the command processor and within the graphical user interface.

    摘要翻译: 集成电路设计套件的命令处理器具有用于解释用户命令的图形用户界面和命令解释器。 图形用户界面在运行时完全由用户指定。 与集成电路设计过程中的过程相对应的一个或多个设计工具在命令处理器的控制下并在图形用户界面内操作。

    Method of using filler metal for implementing changes in an integrated circuit design
    4.
    发明授权
    Method of using filler metal for implementing changes in an integrated circuit design 有权
    使用填充金属实现集成电路设计变更的方法

    公开(公告)号:US06748579B2

    公开(公告)日:2004-06-08

    申请号:US10231904

    申请日:2002-08-30

    IPC分类号: G06F1750

    CPC分类号: G06F17/5068

    摘要: A method is provided for fabricating an integrated circuit having a logical function. The method includes fabricating first and second routing layer masks and a first via mask. The first routing layer mask includes power supply segments and signal segments. The second routing layer mask includes signal segments and filler segments, wherein the filler segments are located in unused areas of the second routing layer mask. The first via mask defines vias that electrically couple the filler segments to the power supply segments. If the logical function is changed after the masks have been fabricated, a second via mask is fabricated. The second via mask decouples a filler segment from the power supply segments and couples the filler segment to a signal segment defined by the first routing layer mask to implement the logical function change. The integrated circuit is then fabricated with the first and second routing layer masks and the second via mask.

    摘要翻译: 提供了一种用于制造具有逻辑功能的集成电路的方法。 该方法包括制造第一和第二路由层掩模和第一通孔掩模。 第一路由层掩码包括电源段和信号段。 第二路由层掩码包括信号段和填充段,其中填充段位于第二路由层掩码的未使用区域中。 第一个通孔掩模定义将填料段电耦合到电源段的通孔。 如果在制造掩模之后改变逻辑功能,则制造第二通孔掩模。 第二通孔掩模将填充段与电源段分离,并将填充段耦合到由第一路由层掩码定义的信号段,以实现逻辑功能改变。 然后利用第一和第二路由层掩模和第二通孔掩模制造集成电路。