公开(公告)号：US4894184A

公开(公告)日：1990-01-16

申请号：US043096

申请日：1987-04-27

申请人： Shingoro Fukuoka ,  Kouichi Shintomi ,  Ryu Maeda ,  Kaisuke Shiroyama

发明人： Shingoro Fukuoka ,  Kouichi Shintomi ,  Ryu Maeda ,  Kaisuke Shiroyama

IPC分类号： C09D5/24 ,  H01B1/16 ,  H05K1/09

CPC分类号： H05K1/092 ,  H01B1/16

摘要： A low-temperature burnt conductive paste prepared by dispersing, in an organic vehicle, a base material comprising 50 to 95% by weight of a powder of at least one conductive material selected from the group consisting of a copper alloy, a copper oxide and a copper alloy oxide and 5 to 50% by weight of a glass powder having a softening point of 300.degree. to 600.degree. C. and a coefficient of thermal expansion of 6 to 13.times.10.sup.-6 .degree.C..sup.-1, and a method of manufacturing a printed circuit board using this paste.

摘要翻译： 一种低温烧制导电膏，其通过在有机载体中分散包含50至95重量％的至少一种选自铜合金，氧化铜和 铜合金氧化物和5〜50重量％的软化点为300〜600℃，热膨胀系数为6〜13×10 -6℃-1的玻璃粉末，以及制造方法 印刷电路板使用这种膏。