公开(公告)号：US20080165449A1

公开(公告)日：2008-07-10

申请号：US12008275

申请日：2008-01-09

申请人： Hitoshi Shindo ,  Teruhiro Nakamiya ,  Kouki Uefume ,  Takako Hayakawa

发明人： Hitoshi Shindo ,  Teruhiro Nakamiya ,  Kouki Uefume ,  Takako Hayakawa

IPC分类号： G11B33/14

CPC分类号： G11B33/1466 ,  G11B25/043 ,  G11B33/122

摘要： In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.

摘要翻译： 在其中密封低密度气体的盘驱动装置中，本发明的实施例有助于提高馈通和外壳之间的焊接部分处的关节可靠性，这是由于由于使用中的温度环境变化而引起的变形而施加的应力 。 根据一个实施例，氦气密封在HDD的内部空间中。 馈通焊接到基座的馈通安装表面。 在具有相对较大的热应力的部分，馈通安装面的宽度增加，并且在热应力相对较小的部分，馈通安装面的宽度减小。 这防止由于热应力而在焊接部分产生裂纹穿透路径，并且防止焊接部分接触销。

公开(公告)号：US07872836B2

公开(公告)日：2011-01-18

申请号：US12008275

申请日：2008-01-09

申请人： Hitoshi Shindo ,  Teruhiro Nakamiya ,  Kouki Uefume ,  Takako Hayakawa

发明人： Hitoshi Shindo ,  Teruhiro Nakamiya ,  Kouki Uefume ,  Takako Hayakawa

IPC分类号： G11B33/14

CPC分类号： G11B33/1466 ,  G11B25/043 ,  G11B33/122

摘要： In a disk drive device in which low-density gas is sealed, embodiments of the present invention help to improve joint reliability at a solder joint section between a feedthrough and an enclosure with respect to stress applied by deformation due to changes in temperature environment in use. According to one embodiment, helium gas is sealed in an interior space of an HDD. A feedthrough is solder jointed to a feedthrough mounting surface of a base. At a part with relatively large thermal stress, a width of the feedthrough mounting surface is increased, and at a part with relatively small thermal stress, a width of the feedthrough mounting surface is decreased. This prevents a crack penetrating path from being generated at the solder joint section due to the thermal stress and prevents the solder joint section from contacting pins.

摘要翻译： 在其中密封低密度气体的盘驱动装置中，本发明的实施例有助于提高馈通和外壳之间的焊接部分处的关节可靠性，这是由于由于使用中的温度环境变化而引起的变形而施加的应力 。 根据一个实施例，氦气密封在HDD的内部空间中。 馈通焊接到基座的馈通安装表面。 在具有相对较大的热应力的部分，馈通安装面的宽度增加，并且在热应力相对较小的部分，馈通安装面的宽度减小。 这防止由于热应力而在焊接部分产生裂纹穿透路径，并且防止焊接部分接触销。