公开(公告)号：US20060051887A1

公开(公告)日：2006-03-09

申请号：US11218553

申请日：2005-09-06

申请人： Kiyofumi Yamamoto ,  Kousuke Takasaki ,  Kazuo Okutsu

发明人： Kiyofumi Yamamoto ,  Kousuke Takasaki ,  Kazuo Okutsu

IPC分类号： H01L21/00

CPC分类号： H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/00

摘要： The present invention provides a method of manufacturing solid-state imaging devices comprising the steps of: forming a large number of solid-state image sensing devices over a wafer; forming, in positions matching said solid-state image sensing devices on the under face of a transparent flat plate to be joined to said wafer, frame-shaped spacers of a prescribed thickness each in a shape of surrounding an individual solid imaging element; aligning said wafer and said transparent flat plate opposite each other; supporting with a fixed table substantially the whole of one of the under face of said wafer and the upper face of said transparent flat plate, supporting substantially the other face with a pressing member via an elastic member, and thereby joining said wafer and said transparent flat plate via said spacers by the pressing member; and splitting said wafer and said transparent flat plate individual solid-state image sensing devices.

摘要翻译： 本发明提供一种制造固态成像装置的方法，包括以下步骤：在晶片上形成大量的固态图像感测装置; 在要连接到所述晶片的透明平板的下表面上与所述固态图像感测装置匹配的位置中，形成规定厚度的框形隔离物，每个都具有包围单个固体成像元件的形状; 使所述晶片和所述透明平板彼此相对对准; 以大致整个所述晶片的下表面和所述透明平板的上表面的整个表面支撑固定台，通过弹性构件用按压构件基本上支撑另一面，从而将所述晶片和所述透明平板 通过所述按压构件通过所述间隔件平板; 以及分离所述晶片和所述透明平板单独的固态图像感测装置。