公开(公告)号：US20110171338A1

公开(公告)日：2011-07-14

申请号：US12948179

申请日：2010-11-17

申请人： DongChul Han ,  Sanggeun Kim ,  Kyoungrae Cho ,  Dongsoo Lee ,  Jongkak Jang ,  Ho-Soo Jang

发明人： DongChul Han ,  Sanggeun Kim ,  Kyoungrae Cho ,  Dongsoo Lee ,  Jongkak Jang ,  Ho-Soo Jang

IPC分类号： B29C45/24

CPC分类号： B29C45/38 ,  B29C45/14655

摘要： Provided are a device and method for molding a compound. The device for molding a compound may include a lower mold, an upper mold, and a cull degating unit. The lower mold may be configured to support a substrate and attach to a compound injector and the upper mold may be configured to cover the lower mold to form a space between the lower mold and the upper mold for receiving a compound from the compound injector. The cull degating unit may be in the upper mold and the cull degating unit may be configured to separate a cull of the compound in an injection passage from the compound molded on the substrate. The compound injector may be configured to inject a compound into the device such that a least a portion of the compound is molded on the substrate.

摘要翻译： 提供了一种用于模制化合物的装置和方法。 用于模制化合物的装置可以包括下模具，上模具和剔除装置。 下模具可以构造成支撑基板并附接到复合注射器，并且上模具可以构造成覆盖下模具以在下模具和上模具之间形成用于从复合注射器接收化合物的空间。 剔除单元可以在上模具中，并且剔除单元可以被配置为将喷射通道中的化合物的剔除与模制在基板上的化合物分离。 复合注射器可以被配置为将化合物注射到装置中，使得至少一部分化合物在基底上模制。