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1.发明授权Photo-curable polymer composition and flexographic printing plates containing the same 失效光固化聚合物组合物和含有它们的柔版印刷版公开(公告)号：US06506541B2
公开(公告)日：2003-01-14
申请号：US09850649
申请日：2001-05-07
IPC分类号： G03C173
CPC分类号： G03F7/033 , B41M1/04 , B41N1/06 , B41N1/12 , C08L53/02 , Y10S430/106 , Y10S430/108 , Y10S430/117 , C08L2666/24
摘要： The present invention relates to a photo-curable polymer composition comprising: a) a first block copolymer comprising at least two blocks A of polymerised mono-vinyl aromatic monomer, and at least one block B of polymerised conjugated diene monomer, wherein the total polymerised mono-vinyl aromatic monomer content is in the range from 5 to 25% by weight of the block copolymer; b) 5 to 10% by weight of a second block copolymer having one block A of polymerised mono-vinyl aromatic monomer and at least one block B of polymerised conjugated diene monomer, wherein the total polymerised mono-vinyl aromatic monomer content is in the range from 5 to 50% by weight of the block copolymer, alkoxy or epoxy functional groups; and c) at least 5% by weight of a low molecular weight block copolymer, wherein the total of (b) and (c) is from 15% by weight to 80% by weight, the low molecular weight block copolymer having one block A of polymerised mono-vinyl aromatic monomer, and at least one block B of polymerised conjugated diene monomer, and having a weight average molecular weight in the range of from 1,000 to 35,000.
摘要翻译： 本发明涉及光固化聚合物组合物，其包含：a）包含聚合的单乙烯基芳族单体的至少两个嵌段A和至少一个聚合的共轭二烯单体的嵌段B的第一嵌段共聚物，其中总聚合的单 乙烯基芳族单体含量在嵌段共聚物的5至25重量％的范围内; b）5至10重量％的具有一个嵌段A的聚合的单乙烯基芳族单体和至少一个聚合的共轭二烯单体的嵌段B的第二嵌段共聚物，其中总聚合的单乙烯基芳族单体含量在 5〜50重量％的嵌段共聚物，烷氧基或环氧官能团; 和c）至少5重量％的低分子量嵌段共聚物，其中（b）和（c）的总量为15重量％至80重量％，低分子量嵌段共聚物具有一个嵌段A 的聚合的单乙烯基芳族单体和至少一个聚合的共轭二烯单体的嵌段B，并且其重均分子量在1,000至35,000的范围内。
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公开(公告)号：US5719226A
公开(公告)日：1998-02-17
申请号：US697804
申请日：1996-08-30
IPC分类号： C09J153/02 , C08L53/02
CPC分类号： B32B7/12 , B32B27/32 , C09J153/02
摘要： The present invention provides a low viscosity, hot melt adhesive composition which is especially suited for use in disposables and is comprised of a) 100 parts by weight of a blend of i) a styrene-diene triblock copolymer, hydrogenated or unhydrogenated, having a weight average molecular weight of 30,000 to 175,000 and a polystyrene content of from 10 to 40% by weight, and ii) an unhydrogenated styrene-isoprene diblock copolymer having a weight average molecular weight of 10,000 to 30,000 and a polystyrene content of from 10 to 40% by weight, wherein the diblock copolymer comprises from 60 to 95% by weight of the blend, and b) 100 to 275 parts by weight of a tackifying resin which is compatible with the diene blocks. In its preferred embodiment, the invention is the use of SI diblock polymer with a much smaller amount of conventional SEBS or SEPS triblock polymer to produce an extremely low viscosity product which can be processed in the type of equipment presently in use by disposables manufacturers and to be used in disposables assembly applications.
摘要翻译： 本发明提供了一种低粘度的热熔粘合剂组合物，其特别适用于一次性用品，并且包括a）100重量份的i）苯乙烯 - 二烯三嵌段共聚物，其氢化或未氢化的共混物，其具有重量 平均分子量为30,000〜175,000，聚苯乙烯含量为10〜40重量％，ii）重均分子量为10,000〜30,000，聚苯乙烯含量为10〜40重量％的未氢化苯乙烯 - 异戊二烯二嵌段共聚物， ，其中二嵌段共聚物包含60至95重量％的共混物，和b）100-275重量份与二烯嵌段相容的增粘树脂。 在其优选的实施方案中，本发明是使用具有少量常规SEBS或SEPS三嵌段聚合物的SI二嵌段聚合物来生产极低粘度的产品，其可以在一次性制造商目前使用的设备类型中加工， 用于一次性组装应用。
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公开(公告)号：US06211272B1
公开(公告)日：2001-04-03
申请号：US09267263
申请日：1999-03-12
IPC分类号： C08J300
CPC分类号： C09J123/20 , C08L53/00 , C08L53/02 , C08L57/00 , C08L93/00 , C08L2666/24
摘要： It has been surprisingly found that certain properties including adhesion strength to smooth surfaces may be improved by making hot melt adhesives from blends comprising a poly-1-butene polymer, a tackifier resin, and from 3 wt. % to 25 wt. % of a liquid or semi-liquid, hydrogenated or partially hydrogenated low molecular weight conjugated diene polymer prepared by anionic polymerization. Any one of the following three polymers can be used in the adhesive formulation of this invention: 1) a hydrogenated styrene isoprene diblock copolymer having a number average molecular weight from 4000 to 30,000, preferably 6000 to 15,000, a polystyrene content of 5 to 15 percent by weight, preferably 8 to 12 percent by weight, which is at least 75 percent hydrogenated, preferably at least 85 percent hydrogenated; or 2) a hydrogenated polydiene polymer which may have one diene block of either isoprene or butadiene or maybe a diblock polymer wherein one block is of isoprene and the other block is of butadiene, and wherein the polymer may have a terminal hydroxy group, and wherein the polymer has a number average molecular weight of 500 to 20,000, preferably 1000 to 10,000, and is at least 75 percent hydrogenated, preferably at least 85 percent hydrogenated; or 3) a polyisoprene homopolymer having a number average molecular weight of 15,000 to 40,000, preferably 20,000 to 30,000 which is at least 75 percent hydrogenated, preferably at least 85 percent hydrogenated.
摘要翻译： 已经令人惊奇地发现，通过由包含聚-1-丁烯聚合物，增粘树脂的共混物和3重量份的共混物制成热熔粘合剂，可以改善包括对光滑表面的粘合强度的某些性能。 ％至25wt。 通过阴离子聚合制备的液体或半液体，氢化或部分氢化的低分子量共轭二烯聚合物的％。 以下三种聚合物中的任一种可用于本发明的粘合剂制剂中：1）数均分子量为4000至30,000，优选为6000至15,000，聚苯乙烯含量为5至15％的氢化苯乙烯异戊二烯二嵌段共聚物 ，优选8至12重量％，其为氢化至少75％，优选至少85％氢化; 或2）氢化聚二烯烃聚合物，其可以具有异戊二烯或丁二烯的一个二烯嵌段或可能是二嵌段聚合物，其中一个嵌段是异戊二烯，另一个嵌段是丁二烯，并且其中聚合物可以具有末端羟基，并且其中 该聚合物的数均分子量为500至20,000，优选1000至10,000，并且氢化至少75％，优选至少85％氢化; 或3）数均分子量为15,000至40,000，优选20,000至30,000的聚异戊二烯均聚物，其氢化至少75％，优选至少85％氢化。
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公开(公告)号：US5932648A
公开(公告)日：1999-08-03
申请号：US712402
申请日：1996-09-11
IPC分类号： C09J153/02 , C08L53/02
CPC分类号： C09J153/02
摘要： A low viscosity, low VOC content fumigation adhesive formulation which is comprised ofa) 100 parts by weight (pbw) of a blend of a styrene-diene triblock copolymer, hydrogenated or unhydrogenated, having a weight average molecular weight of 30,000 to 200,000 and a polystyrene content of from 10 to 40% by weight of the polymer, and a styrene-diene diblock copolymer having a weight average molecular weight of 10,000 to 40,000 and a polystyrene content of from 10 to 40% by weight of the polymer, wherein the diblock comprises from 60 to 95% by weight of the polymer blend,b) 75 to 275 parts by weight (pbw) of a tackifying resin which is compatible with the diene blocks, andc) 50 to 200 parts by weight (pbw) of a solvent for the polymer.In its preferred embodiment, the invention is the use of SI diblock polymer with a much smaller amount of conventional SEBS or SEPS triblock polymer to produce an extremely low viscosity product which can be processed in the type of equipment presently in use by fumigation adhesive manufacturers and satisfies the VOC standard of 250 grams per liter or less.
摘要翻译： 低粘度，低VOC含量的熏蒸粘合剂制剂，其由以下组成：a）100重量份（pbw）重均分子量为30,000至200,000的氢化或未氢化的苯乙烯 - 二烯三嵌段共聚物的共混物和 聚苯乙烯含量为10〜40重量％，聚苯乙烯 - 二烯二嵌段共聚物的重均分子量为10,000〜40,000，聚苯乙烯含量为聚合物重量的10〜40重量％，其中二嵌段 包含60至95重量％的聚合物共混物，b）75至275重量份（pbw）与二烯嵌段相容的增粘树脂，和c）50至200重量份（pbw）的 溶剂用于聚合物。 在其优选的实施方案中，本发明是使用具有少量常规SEBS或SEPS三嵌段聚合物的SI二嵌段聚合物来生产极低粘度的产品，其可以在目前使用的熏蒸胶粘剂制造商的设备类型中进行加工， 满足VOC标准250克/升或更低。
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