公开(公告)号：US20110069449A1

公开(公告)日：2011-03-24

申请号：US12562546

申请日：2009-09-18

申请人： Arlyn Earl Miller ,  Gary Law ,  Kent A. Burr ,  Paul Noble-Campbell ,  Vincent Lam ,  Laura Avery ,  Garrett Lewis ,  Kevin Sloan ,  Mark William Foohey

发明人： Arlyn Earl Miller ,  Gary Law ,  Kent A. Burr ,  Paul Noble-Campbell ,  Vincent Lam ,  Laura Avery ,  Garrett Lewis ,  Kevin Sloan ,  Mark William Foohey

IPC分类号： H05K7/20

CPC分类号： H05K7/20145

摘要： Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

摘要翻译： 这里描述了提供改善的散热的电子设备外壳。 用于保持电子电路板的示例性外壳包括具有耦合到第二部分以形成用于保持电子电路板的空腔的第一部分的壳体。 第一和第二部分中的每一个包括同时在电子电路板的相对面上引导常规气流的开口。 挡板耦合到壳体以基本上视觉上遮蔽开口并且限定壳体和挡板之间的间隙，以引导对流气流穿过电子电路板的相对面。

公开(公告)号：US07903405B1

公开(公告)日：2011-03-08

申请号：US12562546

申请日：2009-09-18

申请人： Arlyn Earl Miller ,  Gary Law ,  Kent A. Burr ,  Paul Noble-Campbell ,  Vincent Lam ,  Laura Avery ,  Garrett Lewis ,  Kevin Sloan ,  Mark William Foohey

发明人： Arlyn Earl Miller ,  Gary Law ,  Kent A. Burr ,  Paul Noble-Campbell ,  Vincent Lam ,  Laura Avery ,  Garrett Lewis ,  Kevin Sloan ,  Mark William Foohey

IPC分类号： H05K7/20

CPC分类号： H05K7/20145

摘要： Electronic device enclosures providing improved heat dissipation are described herein. An example enclosure for holding an electronic circuit board includes a housing having a first portion coupled to a second portion to form a cavity to hold the electronic circuit board. Each of the first and second portions comprises openings to direct convention airflow across opposing faces of the electronic circuit board at the same time. A baffle is coupled to the housing to substantially visually obscure the openings and to define a gap between the housing and the baffle to direct the convection airflow across the opposing faces of the electronic circuit board.

摘要翻译： 这里描述了提供改善的散热的电子设备外壳。 用于保持电子电路板的示例性外壳包括具有耦合到第二部分以形成用于保持电子电路板的空腔的第一部分的壳体。 第一和第二部分中的每一个包括同时在电子电路板的相对面上引导常规气流的开口。 挡板耦合到壳体以基本上视觉上遮蔽开口并且限定壳体和挡板之间的间隙，以引导对流气流穿过电子电路板的相对面。