公开(公告)号：US20120008896A1

公开(公告)日：2012-01-12

申请号：US13157419

申请日：2011-06-10

Applicant: Ming-Chang Lee ,  Kai-Ning Ku ,  Chung-Yung Wang ,  Kuo-Chung Huang ,  Tsung-Chi Hsu ,  Chung-Hsin Fu ,  Lin-Yu Tai

Inventor： Ming-Chang Lee ,  Kai-Ning Ku ,  Chung-Yung Wang ,  Kuo-Chung Huang ,  Tsung-Chi Hsu ,  Chung-Hsin Fu ,  Lin-Yu Tai

IPC: G02B6/125

CPC classification number: G02B6/29346 ,  G02B6/125 ,  G02B6/4246

Abstract: The present invention relates to an integrate optics for multiplexer transceiver module, comprising: a substrate, a multiplexer, a first waveguide coupling device, a second waveguide coupling device and a third waveguide coupling device. In the present invention, the semiconductor materials and the semiconductor process are used to integrate variety of optical devices on a single semiconductor substrate (chip) by way of modular design and miniaturization, so as to carry out an integrated optics communication framework with high efficiency and low cost. Moreover, in the present invention, a plurality of optical receivers are integrated on the substrate by means of flip-chip bonding, so that, not only the objective of integrating the optical devices is accomplished but also the intensity of laser optical signal is increased.

Abstract translation: 本发明涉及一种用于多路收发器模块的集成光学器件，包括：衬底，多路复用器，第一波导耦合器件，第二波导耦合器件和第三波导耦合器件。 在本发明中，半导体材料和半导体工艺用于通过模块化设计和小型化将单个半导体衬底（芯片）上的各种光学器件集成在一起，从而实现高效率的集成光通信框架， 低成本。 此外，在本发明中，通过倒装芯片接合将多个光接收器集成在基板上，不仅实现了对光器件的集成的目的，而且提高了激光光信号的强度。