公开(公告)号：US07706595B2

公开(公告)日：2010-04-27

申请号：US10978687

申请日：2004-11-01

申请人： Thomas W. Bushman ,  David D. Madsen ,  Paul R. Haugen ,  Steven K. Case ,  John D. Gaida ,  M. Hope Madsen

发明人： Thomas W. Bushman ,  David D. Madsen ,  Paul R. Haugen ,  Steven K. Case ,  John D. Gaida ,  M. Hope Madsen

IPC分类号： G06K9/00

CPC分类号： H05K13/0812

摘要： Embodiments include measuring motion characteristics of the workpiece through the placement process. Since the component is placed on the workpiece with some force to ensure proper adhesion to the workpiece, some deflection of the workpiece is expected during the placement cycle. The placement force is adjusted to ensure that the component is safely placed into the solder paste or adhesive. Placement force is adjusted through a number of characteristics including: choice of spring tension in the nozzle; the length of the nozzle and the amount of over-travel into the board; the rigidity of the board and design; and the placement of the board support mechanisms. With proper adjustment of these characteristics and parameters, high quality placements onto the workpiece can be ensured.

摘要翻译： 实施例包括通过放置过程测量工件的运动特性。 由于组件以一定的力放置在工件上，以确保与工件的适当粘合，所以在放置循环期间可以预期工件的一些挠曲。 调整放置力以确保组件安全地放入焊膏或粘合剂中。 放置力通过多种特性进行调整，包括：选择喷嘴中的弹簧张力; 喷嘴的长度和过度进​​入板的量; 板的刚性和设计; 以及电路板支撑机构的放置。 通过适当调整这些特性和参数，可以确保高品质的放置在工件上。