Abstract:
A specimen testing package includes a sensor chip provided in its front face with a fixing region of a reactant selectively reacting with a specimen contained in a specimen solution, a substrate to which a back face of the sensor chip is fixed, an external connection lead electrically connected to the sensor chip via a wire, an insulator provided in the substrate for insulating the wire from the outside, and a surrounding wall surrounding the fixing region in form of a continuous loop.
Abstract:
The present invention relates to a method of internal correction in one chip assay, and to a method for measuring a test substance using the method of internal correction. Specifically, an assay system for measuring a test substance and an assay system for measuring an internal standard substance on a single chip are implemented to thereby internally correct measurement values of a test substance. Normalizing measurement values of a test substance using this internal correction quantifies the test substance.