公开(公告)号：US20050129909A1

公开(公告)日：2005-06-16

申请号：US10966069

申请日：2004-10-15

申请人： Harrie Hermens ,  Mark Van Bommel ,  Armin Plichta ,  Thomas Zetterer

发明人： Harrie Hermens ,  Mark Van Bommel ,  Armin Plichta ,  Thomas Zetterer

IPC分类号： G02F1/1333 ,  B32B3/18 ,  B32B3/24 ,  B32B3/26 ,  B32B7/06 ,  B32B17/00 ,  B32B17/06 ,  G02F1/13 ,  B32B3/10

CPC分类号： B32B7/06 ,  B32B3/18 ,  B32B3/26 ,  B32B17/06 ,  Y10T428/24331

摘要： The invention relates to a composite which comprises a substrate, especially an ultra-thin substrate with a thickness of less than 0.3 mm, and a carrier substrate, with the substrate being detachably connected at least indirectly with the carrier substrate. The composite in accordance with the invention is characterized in that a spacer layer with recesses is introduced between substrate and carrier substrate, with the recesses being provided at least in the surface of the spacer layer which faces the substrate.

摘要翻译： 本发明涉及一种复合材料，其包括基材，特别是厚度小于0.3mm的超薄基材和载体基材，其中基材至少间接地与载体基材可分离连接。 根据本发明的复合材料的特征在于，具有凹陷的间隔层被引入到基底和载体基底之间，其中凹部至少设置在与衬底相对的间隔层的表面中。