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公开(公告)号：US09355919B2
公开(公告)日：2016-05-31
申请号：US13818967
申请日：2011-08-23
CPC分类号： H01L22/12 , G01N21/9501
摘要： A method of inspecting a bonded wafer 3 arrangement comprises: directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture δ of the imaging 16, 18 is less than 0.05; and simultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view; wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.
摘要翻译： 检查接合晶片3布置的方法包括：引导测量辐射通过键合晶片装置3; 使用穿过所述键合晶片布置的测量辐射，将所述结合晶片布置的至少一部分成像到检测器19上，其中所述成像16,18的物体侧数值孔径δ小于0.05; 并且同时检测使用检测器19的测量辐射的至少一部分已经在视场内的多个不同间隔开的位置23处穿过键合晶片布置; 其中所检测的辐射具有强度谱，使得具有小于700nm的波长的检测到的辐射的强度小于检测到的辐射的总强度的10％，并且具有大于1200nm的波长的检测到的辐射的强度较小 超过检测辐射总强度的10％。
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2.发明申请Method and an apparatus for the determination of the 3D coordinates of an object 有权用于确定对象的3D坐标的方法和装置公开(公告)号：US20080130016A1
公开(公告)日：2008-06-05
申请号：US11973968
申请日：2007-10-11
IPC分类号： G01B11/03
CPC分类号： G01B11/2513
摘要： A method serves for the determination of the 3D coordinates of an object (2). A fringe pattern is projected onto the object (2) in the method. The light reflected by the object (2) is recorded and evaluated. To improve such a method, the fringe pattern is projected onto the object (2) by an imaging element (only FIGURE).
摘要翻译： 方法用于确定对象（2）的3D坐标。 在该方法中，将条纹图案投影到物体（2）上。 由对象（2）反射的光被记录和评估。 为了改善这种方法，通过成像元件（仅图示）将条纹图案投射到物体（2）上。
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公开(公告)号：US20130157391A1
公开(公告)日：2013-06-20
申请号：US13818967
申请日：2011-08-23
CPC分类号： H01L22/12 , G01N21/9501
摘要： A method of inspecting a bonded wafer 3 arrangement comprises: directing measuring radiation through the bonded wafer arrangement 3; imaging at least a portion of the bonded wafer arrangement onto a detector 19 using the measuring radiation having traversed the bonded wafer arrangement, wherein an object side numerical aperture δ of the imaging 16, 18 is less than 0.05; and simultaneously detecting, using the detector 19, at least a portion of the measuring radiation having traversed the bonded wafer arrangement at a multitude of different spaced apart locations 23 within the field of view; wherein the detected radiation has an intensity spectrum such that an intensity of the detected radiation having wavelengths less than 700 nm is less than 10% of a total intensity of the detected radiation and an intensity of the detected radiation having wavelengths greater than 1200 nm is less than 10% of the total intensity of the detected radiation.
摘要翻译： 检查接合晶片3布置的方法包括：引导测量辐射通过键合晶片装置3; 使用穿过所述键合晶片布置的测量辐射将所述结合晶片布置的至少一部分成像到检测器19上，其中所述成像16,18的物体侧数值孔径δ小于0.05; 并且同时检测使用检测器19的测量辐射的至少一部分已经在视场内的多个不同间隔开的位置23处穿过键合晶片布置; 其中所检测的辐射具有强度谱，使得具有小于700nm的波长的检测到的辐射的强度小于检测到的辐射的总强度的10％，并且具有大于1200nm的波长的检测到的辐射的强度较小 超过检测辐射总强度的10％。
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4.发明授权Method and an apparatus for the determination of the 3D coordinates of an object 有权用于确定对象的3D坐标的方法和装置公开(公告)号：US07570370B2
公开(公告)日：2009-08-04
申请号：US11973968
申请日：2007-10-11
IPC分类号： G01B11/24
CPC分类号： G01B11/2513
摘要： A method serves for the determination of the 3D coordinates of an object (2). A fringe pattern is projected onto the object (2) in the method. The light reflected by the object (2) is recorded and evaluated. To improve such a method, the fringe pattern is projected onto the object (2) by an imaging element (only FIGURE).
摘要翻译： 方法用于确定对象（2）的3D坐标。 在该方法中，将条纹图案投影到物体（2）上。 由对象（2）反射的光被记录和评估。 为了改善这种方法，通过成像元件（仅图示）将条纹图案投射到物体（2）上。
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