Apparatus for removing electroplating metal deposited onto surface of
conductor roll
    1.
    发明授权
    Apparatus for removing electroplating metal deposited onto surface of conductor roll 失效
    用于去除沉积在导体辊表面上的电镀金属的装置

    公开(公告)号:US4929323A

    公开(公告)日:1990-05-29

    申请号:US392985

    申请日:1989-08-14

    IPC分类号: C25D7/06 C25F5/00

    CPC分类号: C25D7/0657 C25F5/00

    摘要: An apparatus for removing, through reverse electrolysis, an electroplating metal deposited onto the surface of a conductor roll for electroplating. The above-mentioned removal is accomplished by means of a reverse-electrolylzing electrode (23) provided in the electroplating solution near the conductor roll (5). The start and the end of the removal can properly be controlled on the basis of a value of potential difference between a reference electrode (21) immersed in the electroplating solution and the conductor roll (5), as measured by means of a potentiometer (25). The reverse-electrolyzing electrode (23) return-travels, together with the reference electrode (21), in the axial direction of the conductor roll (5) by the action of a reverse-electrolyzing electrode moving mechanism (30).

    摘要翻译: PCT No.PCT / JP88 / 01284 Sec。 371日期1989年8月14日 102(e)日期1989年8月14日PCT提交1988年12月19日PCT公布。 出版物WO89 / 05875 日期:1989年6月29日。一种用于通过反向电解除去沉积在用于电镀的导体辊表面上的电镀金属的装置。 通过在导电辊(5)附近的电镀液中设置的反向电解电极(23)实现上述的除去。 基于浸入电镀液中的参考电极(21)和导体辊(5)之间的电位差的值,可以根据电位计(25)测量,可以适当地控制去除的开始和结束 )。 反电解电极(23)通过反向电解电极移动机构(30)的作用在导体辊(5)的轴向上与参考电极(21)一起返回。