公开(公告)号：US07706919B2

公开(公告)日：2010-04-27

申请号：US10488694

申请日：2002-09-06

申请人： Masaru Adachi ,  Mitsunori Kawabe ,  Masaru Shigesada

发明人： Masaru Adachi ,  Mitsunori Kawabe ,  Masaru Shigesada

IPC分类号： G05B19/04 ,  G05B19/18

CPC分类号： H01L21/67259 ,  H01L21/681 ,  H01L21/68707 ,  Y10T29/41

摘要： An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method.To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.

摘要翻译： 本发明的目的是提供一种用于在不依赖操作者的视线以及用于上述方法的示教夹具的情况下自动而准确地教导半导体晶片的位置的方法。 为此，在本发明中，通过设置在机器人的晶片抓持部5的前端的第一透射型传感器6来检测示教夹具11。 示教夹具11由与半圆形晶片外径相同的大圆盘部分12和与大圆盘部分12同心的小圆盘部分13组成。示教夹具21由第二传动 - 型传感器18设置在晶片抓持部5上。第二传输型传感器18安装在传感器夹具15上，以便从晶片夹持部分5可拆卸。

公开(公告)号：US20050034288A1

公开(公告)日：2005-02-17

申请号：US10488694

申请日：2002-09-06

申请人： Masaru Adachi ,  Mitsunori Kawabe ,  Masaru Shigesada

发明人： Masaru Adachi ,  Mitsunori Kawabe ,  Masaru Shigesada

IPC分类号： B25J9/22 ,  H01L21/00 ,  H01L21/68 ,  H01L21/687 ,  H01L21/64

CPC分类号： H01L21/67259 ,  H01L21/681 ,  H01L21/68707 ,  Y10T29/41

摘要： An object is to provide a method for teaching the position of a semiconductor wafer automatically and accurately without relying on the sight of an operator as well as a teaching jig that is used for the above method. To this end, in the invention, a teaching jig 11 is detected by a first transmission-type sensor 6 that is provided at the tips of a wafer gripping portion 5 of a robot. The teaching jig 11 is composed of a large disc portion 12 that is the same in outer diameter as a semiconductor wafer and a small disc portion 13 that is concentric with the large disc portion 12. The teaching jig 21 is detected by a second transmission-type sensor 18 that is provided on the wafer gripping portion 5. The second transmission-type sensor 18 is mounted on a sensor jig 15 so as to be detachable form the wafer gripping portion 5.

摘要翻译： 本发明的目的是提供一种用于在不依赖操作者的视线以及用于上述方法的示教夹具的情况下自动而准确地教导半导体晶片的位置的方法。 为此，在本发明中，通过设置在机器人的晶片抓持部5的前端的第一透射型传感器6来检测示教夹具11。 示教夹具11由与半圆形晶片外径相同的大圆盘部分12和与大圆盘部分12同心的小圆盘部分13组成。示教夹具21由第二传动 - 型传感器18设置在晶片抓持部5上。第二传输型传感器18安装在传感器夹具15上，以便从晶片夹持部分5可拆卸。