Method and arrangement for impregnating chips
    1.
    发明授权
    Method and arrangement for impregnating chips 有权
    浸渍芯片的方法和布置

    公开(公告)号:US07901541B2

    公开(公告)日:2011-03-08

    申请号:US11572106

    申请日:2005-07-14

    IPC分类号: D21C1/00

    CPC分类号: D21C1/00 D21C3/00

    摘要: The method is for the impregnation of chips during the manufacture of chemical pulp. The chips are continuously fed without preceding steam treatment to the top of an impregnation vessel that maintains atmospheric pressure. Impregnation fluid (BL) is added to the impregnation vessel and establishes a fluid level (LIQ_LEV). The chips that have been added establish a chips level (CH_LEV) that lies at least 3-5 meters over the fluid level. The temperature at the top of the vessel essentially corresponds to ambient temperature.Impregnation fluid BL is fed in to the impregnation vessel in such an amount and at such a temperature that the temperature that is established at the fluid level (LIQ_LEV) is established within the interval 90-115° C., preferably within the interval 95-105° C.

    摘要翻译: 该方法是在制造化学纸浆期间浸渍碎片。 将芯片连续地进料而不进行先前的蒸汽处理,以保持大气压力的浸渍容器的顶部。 将浸渍液(BL)加入到浸渍容器中并建立液位(LIQ_LEV)。 已经添加的芯片建立了在液位上至少3-5米的芯片级别(CH_LEV)。 容器顶部的温度基本上对应于环境温度。 浸渍流体BL以这样一定量的温度进料到浸渍容器中,使得在液面(LIQ_LEV)下建立的温度建立在90-115℃范围内,优选地在95- 105℃

    Method and Arrangement for Impregnating Chips
    2.
    发明申请
    Method and Arrangement for Impregnating Chips 有权
    浸渍芯片的方法和布置

    公开(公告)号:US20080093041A1

    公开(公告)日:2008-04-24

    申请号:US11572106

    申请日:2005-07-14

    IPC分类号: D21H11/00

    CPC分类号: D21C1/00 D21C3/00

    摘要: The method is for the impregnation of chips during the manufacture of chemical pulp. The chips are continuously fed without preceding steam treatment to the top of an impregnation vessel that maintains atmospheric pressure. Impregnation fluid (BL) is added to the impregnation vessel and establishes a fluid level (LIQ_LEV). The chips that have been added establish a chips level (CH_LEV) that lies at least 3-5 meters over the fluid level. The temperature at the top of the vessel essentially corresponds to ambient temperature.Impregnation fluid BL is fed in to the impregnation vessel in such an amount and at such a temperature that the temperature that is established at the fluid level (LIQ_LEV) is established within the interval 90-115° C., preferably within the interval 95-105° C.

    摘要翻译: 该方法是在制造化学纸浆期间浸渍碎片。 将芯片连续地进料而不进行先前的蒸汽处理,以保持大气压力的浸渍容器的顶部。 将浸渍液(BL)加入到浸渍容器中并建立液位(LIQ_LEV)。 已经添加的芯片建立了在液位上至少3-5米的芯片级别(CH_LEV)。 容器顶部的温度基本上对应于环境温度。 浸渍流体BL以这样一定量的温度进料到浸渍容器中,使得在液面(LIQ_LEV)下建立的温度建立在90-115℃范围内,优选地在95- 105℃