公开(公告)号：US20050121372A1

公开(公告)日：2005-06-09

申请号：US11036714

申请日：2005-01-14

申请人： Sreenivasan Koduri ,  Matthew Stovall

发明人： Sreenivasan Koduri ,  Matthew Stovall

IPC分类号： H01L21/00 ,  B07C5/344 ,  G01R31/02

CPC分类号： H01L21/67271 ,  H01L21/67132 ,  H01L21/67144

摘要： Various preferred processes and equipment are described herein that more efficiently handle residual semiconductor parts during packaging. The processes include picking and removing all of the bad parts from a wafer before picking the good parts and picking all of the good parts first without picking any part necessary to align the wafer. The equipment includes several embodiments of a transfer machine that accommodates the efficient transfer of semiconductor parts between tacky film, waffle packs and tape and reel containment systems. Residual good parts are stored in waffle packs and can be subsequently reused in the packaging process.