公开(公告)号：US5328085A

公开(公告)日：1994-07-12

申请号：US931786

申请日：1992-08-18

申请人： Bradley N. Stoops ,  Melaney S. Stoops

发明人： Bradley N. Stoops ,  Melaney S. Stoops

IPC分类号： B23K1/20 ,  B23K3/08 ,  B23K37/00

CPC分类号： B23K3/082 ,  B23K1/203 ,  B23K2201/40

摘要： A dispensing apparatus for applying a thin stream of flux to a surface of a printed circuit board. The dispensing head travels at a high rate of speed relative to the board during the dispensing of flux to apply thin layers of flux thereto. Preferably, the dispensing head moves transversely to the work path of a conveyor that transports the board through a flux station, at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board and, if desired, make multiple passes over the surface to coat selected regions twice. Either the board is incrementally advanced through the flux station or the dispensing head is incrementally advanced relative to the board so that flux is applied when the board is stationary.

摘要翻译： 一种用于将薄的助焊剂流施加到印刷电路板的表面的分配装置。 在分配焊剂期间，分配头以相对于板的高速度行进，以向其施加薄层的助焊剂。 优选地，分配头横向移动到输送机的工作路径，该输送机以约20至90英寸/秒的速率运输板通过通量站。 分配助焊剂的提示物相对于板成角度地设置，并且如果需要，在表面上进行多次通过以涂覆所选择的区域两次。 板通过通量站逐步推进，或者分配头相对于板递增地前进，使得当板静止时施加通量。