Method for making large scale multilayer dielectric diffraction gratings on thick substrates using reactive ion etching
    6.
    发明授权
    Method for making large scale multilayer dielectric diffraction gratings on thick substrates using reactive ion etching 有权
    使用反应离子蚀刻在厚基板上制作大规模多层介质衍射光栅的方法

    公开(公告)号:US07256938B2

    公开(公告)日:2007-08-14

    申请号:US11083689

    申请日:2005-03-17

    IPC分类号: G02B5/18

    CPC分类号: G02B5/1857

    摘要: Methods of fabricating large size, high performance multilayer diffraction gratings having a thick substrate that take advantage of reactive ion etching during the fabrication process are provided herein. In one implementation, a method of making a multilayer diffraction grating comprises the steps of: providing a substrate having a thickness of at least 2.0 cm; applying a dielectric structure having a plurality of layers on the substrate; depositing a photoresist; exposing the photoresist to a grating pattern; developing the photoresist to produce the grating pattern in the photoresist; and reactive ion etching to transfer the grating pattern to the dielectric structure. In preferred form, the substrate material of the grating is selected to have low electrical resistivity and high thermal conductivity.

    摘要翻译: 本文提供了制造具有在制造过程中利用反应离子蚀刻的厚衬底的大尺寸,高性能多层衍射光栅的方法。 在一个实施方案中,制备多层衍射光栅的方法包括以下步骤:提供具有至少2.0cm厚度的衬底; 在衬底上施加具有多个层的电介质结构; 沉积光刻胶; 将光致抗蚀剂暴露于光栅图案; 显影光致抗蚀剂以在光致抗蚀剂中产生光栅图案; 和反应离子蚀刻以将光栅图案转印到电介质结构。 在优选的形式中,光栅的基底材料被选择为具有低电阻率和高导热性。