公开(公告)号：US20110111236A1

公开(公告)日：2011-05-12

申请号：US11632463

申请日：2005-07-13

Applicant: Dennis Pahl ,  Norman Blank ,  Uwe Hartmann ,  Michael Stege

Inventor： Dennis Pahl ,  Norman Blank ,  Uwe Hartmann ,  Michael Stege

IPC: B32B15/04 ,  C25D5/00 ,  B05D5/10 ,  B05D3/06

CPC classification number: C09J163/00 ,  C08L2666/02 ,  C08L2666/20 ,  C09J5/02 ,  C09J175/04 ,  C09J2400/166 ,  Y10T428/31678

Abstract: A method for treating a bond area of a workpiece, and a method for adhesively bonding workpieces are disclosed. The method for treating a bond area of a workpiece includes cleaning the bond area, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, and chemically transforming the adhesion promoter with an aftertreatment. The method for adhesively bonding workpieces includes cleaning a bond area of a first workpiece, activating the bond area, coating at least a portion of the bond area with an adhesion promoter, chemically transforming the adhesion promoter with an aftertreatment, applying an adhesive to the bond area, bringing the other workpiece into contact with the first workpiece, and curing the adhesive.

Abstract translation: 公开了一种用于处理工件的粘结区域的方法，以及粘合工件的方法。 用于处理工件的粘合区域的方法包括清洁粘合区域，活化粘合区域，用粘合促进剂涂覆至少一部分粘合区域，以及用后处理化学转化粘合促进剂。 用于粘合工件的方法包括清洁第一工件的粘合区域，活化粘合区域，用粘合促进剂涂覆粘合区域的至少一部分，用后处理化学转化粘合促进剂，将粘合剂施加到粘合剂 使其他工件与第一工件接触，并固化粘合剂。