公开(公告)号：US06471308B1

公开(公告)日：2002-10-29

申请号：US09128045

申请日：1998-08-03

Applicant: Michael Vaughn Konshak ,  Dale Robert Eichel

Inventor： Michael Vaughn Konshak ,  Dale Robert Eichel

IPC: A47B8700

CPC classification number: H05K5/0013 ,  A47B87/0207 ,  F16B12/34

Abstract: The frameless, stackable cabinet system for use with rack mounted electronic equipment comprises stackable wall members that mechanically interconnect without the need for tools to assemble the cabinet. A base unit and cover unit provide the interlocking top and bottom members of the cabinet. The stackable wall members come in various heights and can be interlocked together and to both the base unit and cover unit to configure a cabinet of desired height. Each stackable wall member therefore not only provides a mounting site for a rack mounted piece of electronic equipment, but also serves to provide the wiring channels through openings formed in the stackable wall members. The cabinet system can be transported in a disassembled form to reduce shipping costs and can be simply assembled on site via the interlocking interconnection of the stackable wall members. The resultant cabinet can be reconfigured without a significant effort and the certification of the resultant cabinet configuration can be simplified.

Abstract translation: 与机架安装的电子设备一起使用的无框架的可堆叠机柜系统包括可堆叠的壁构件，其机械地互连而不需要工具来组装机柜。 基座单元和盖单元提供机柜的互锁顶部和底部构件。 可堆叠的壁构件具有各种高度，并且可以互锁在一起，并且与基座单元和盖单元互锁以配置所需高度的机柜。 因此，每个可堆叠壁构件不仅提供了用于机架安装的电子设备的安装位置，而且还用于通过形成在可堆叠壁构件中的开口提供布线通道。 柜系统可以以拆卸的形式运输，以减少运输成本，并且可以通过可堆叠壁构件的互锁互连简单地组装在现场。 所得到的机柜可以重新配置而不需要大量的努力，并且可以简化所得到的机柜配置的认证。

公开(公告)号：US07385812B1

公开(公告)日：2008-06-10

申请号：US11346915

申请日：2006-02-03

Applicant: Michael Vaughn Konshak ,  Michael L. Leonhardt

Inventor： Michael Vaughn Konshak ,  Michael L. Leonhardt

IPC: H05K7/20

CPC classification number: H05K7/20418 ,  G11B33/0438 ,  G11B33/0466

Abstract: A method and apparatus for a thermally conductive packaging technique for cooling electronic systems. A heat source is partially surrounded by a set of thermal transfer media. A set of thermal transfer shells partially surround the set of thermal transfer media. The heat source connection means are left exposed and utilized for connection to the electronic system. The heat source, the set of thermal transfer media configured to partially surround the heat source, and the thermal transfer shell partially surrounding the set of thermal transfer media form a thermal transfer module. Thermal transfer modules may be placed in thermally conductive cells. A set of thermal transfer sheets are placed in contact with both or either of the thermal transfer module and the thermally conductive cell, facilitating a heat exchange with an environment external to the thermal transfer module.

Abstract translation: 一种用于冷却电子系统的导热封装技术的方法和装置。 热源被一组热转印介质部分地包围。 一组热传递壳部分地围绕着一组热转印介质。 热源连接装置被暴露并用于连接到电子系统。 热源，被配置为部分地围绕热源的热传递介质的组和部分地围绕该组热传递介质的热传递壳形成热传递模块。 热传递模块可以放置在导热电池中。 放置一组热转印片与热转印模块和导热电池中的任一个或任一个接触，便于与热转印模块外部的环境进行热交换。

公开(公告)号：USD410451S

公开(公告)日：1999-06-01

申请号：US92189

申请日：1998-08-13

Applicant: Michael Vaughn Konshak ,  Dale Robert Eichel

Designer： Michael Vaughn Konshak ,  Dale Robert Eichel

公开(公告)号：US06946598B1

公开(公告)日：2005-09-20

申请号：US10785603

申请日：2004-02-24

Applicant: Michael Vaughn Konshak

Inventor： Michael Vaughn Konshak

IPC: H05K9/00

CPC classification number: H05K9/0016

Abstract: An EMI shielding gasket for reducing the amount of force required during the mounting process. The present invention provides an extended lip feature on the gasket to facilitate the installation process and to function as a lead-in, such that less force is required by the assembler when mounting the EMI gasket. As less manipulation may be required to install the gaskets, gaskets may be mounted correctly more often, thereby preventing the occurrence of EMI leakage. The present invention also reduces the possibility that the EMI gaskets may become damaged due to excess manipulation, and assemblers may experience fewer physical problems related to manipulating the gaskets. By reducing the amount of force required to mount the EMI gaskets, the present invention may increase productivity by decreasing assembly time, decrease rework of improperly assembled or damaged gaskets, and reduce health risks and subsequent insurance claims of assemblers during manufacturing.

Abstract translation: EMI屏蔽垫片，用于减少安装过程中所需的力量。 本发明在垫圈上提供了一种延长的唇部特征，以便于安装过程并且用作导入装置，使得当安装EMI垫圈时组装商需要较小的力。 由于可能需要较少的操作来安装垫圈，所以可以更经常地正确地安装垫圈，从而防止EMI泄漏的发生。 本发明还降低了EMI垫片由于过度操作而损坏的可能性，并且组装人员可能经历与操作垫圈相关的较少的物理问题。 通过减少安装EMI垫片所需的力量，本发明可以通过减少组装时间，减少错误组装或损坏的垫圈的返工，降低制造过程中组装商的健康风险和随后的保险索赔来提高生产率。

公开(公告)号：US06498723B1

公开(公告)日：2002-12-24

申请号：US09584660

申请日：2000-05-31

Applicant: Michael Vaughn Konshak ,  Barry D. Lovvorn ,  Mark Alan Grabbe ,  Dale Robert Eichel

Inventor： Michael Vaughn Konshak ,  Barry D. Lovvorn ,  Mark Alan Grabbe ,  Dale Robert Eichel

IPC: H05K700

CPC classification number: G11B33/128 ,  G11B33/08

Abstract: A disk drive system includes a disk drive array enclosure forming receiving cavities for housing respective disk drive modules. Each receiving cavity is defined by top, bottom, and rear surfaces, and an opening. The top and bottom surfaces of each receiving cavity expand away from one another to form receiving slots adjacent the opening of the receiving cavity. The disk drive system further includes a disk drive module having a housing and a disk drive carrier handle connected to the housing. The drive module is insertable into a receiving cavity of the drive array enclosure such that the housing is enclosed by the top, bottom, and rear surfaces of the receiving cavity and the drive carrier handle is positioned at the opening of the receiving cavity. The drive carrier handle has tab purchases located around the periphery of the drive carrier handle. The tab purchases engage into respective receiving slots of the drive array enclosure when the drive module is inserted into a receiving cavity of the drive array enclosure to create an interference fit between the drive module and the drive array enclosure and damp vibration transferred between the drive module and the drive array enclosure. The drive carrier handle includes a latching and locking mechanism for latching and locking the drive module to the drive array enclosure. The latching and locking mechanism is pivotally connected to the drive carrier handle to pivot between a closed position for latching the drive module to the drive carrier and an opened position for unlatching the drive module from the drive carrier. The latching and locking mechanism is operable to be locked into the closed position.

Abstract translation: 磁盘驱动器系统包括形成用于容纳各个磁盘驱动器模块的接收腔的磁盘驱动器阵列外壳。 每个接收腔由顶部，底部和后表面以及开口限定。 每个接收腔的顶表面和底表面相互扩展以形成邻近接收腔的开口的接收槽。 磁盘驱动器系统还包括具有壳体的盘驱动器模块和连接到壳体的盘驱动器托架手柄。 驱动模块可插入到驱动阵列外壳的接收腔中，使得壳体被接收腔的顶部，底部和后表面封闭，并且驱动器托架手柄位于接收腔的开口处。 驱动器托架手柄具有位于驱动器托架手柄周边周围的卡舌。 当驱动模块插入到驱动阵列外壳的接收腔中时，卡舌购买卡入到驱动器阵列外壳的各个接收槽中，以在驱动模块和驱动器阵列外壳之间产生干涉配合，并且在驱动模块 和驱动器阵列外壳。 驱动器托架手柄包括用于将驱动模块锁定并锁定到驱动器阵列外壳的闩锁和锁定机构。 闩锁和锁定机构枢转地连接到驱动器托架手柄以在用于将驱动模块锁定到驱动器托架的关闭位置和用于将驱动模块从驱动器托架解锁的打开位置之间枢转。 锁定和锁定机构可操作以锁定到关闭位置。

公开(公告)号：USD410446S

公开(公告)日：1999-06-01

申请号：US91593

申请日：1998-08-03

Applicant: Michael Vaughn Konshak ,  Dale Robert Eichel ,  Mark Alan Grabbe

Designer： Michael Vaughn Konshak ,  Dale Robert Eichel ,  Mark Alan Grabbe