公开(公告)号：US5127988A

公开(公告)日：1992-07-07

申请号：US619983

申请日：1990-11-30

申请人： Shingo Kawamura ,  Minoru Yamada ,  Mioko Ito ,  Akira Ohmura ,  Yoshimasa Yagi

发明人： Shingo Kawamura ,  Minoru Yamada ,  Mioko Ito ,  Akira Ohmura ,  Yoshimasa Yagi

IPC分类号： C23C16/02

CPC分类号： C23C16/0245

摘要： Disclosed is a process for the surface treatment of a conductive material which comprises the steps of disposing a DC electrode having a base material of the conductive material thereon and an RF electrode in a reaction vessel so that the electrodes are parallel to each other; forming a reduced pressure space of a predetermined gas in the vessel; and applying simultaneously a direct current voltage to the DC electrode and a radio-frequency power to the RF electrode so that a surface of the base material is subjected to bombardment treatment under DC discharge and RF discharge. Since the surface treatment of the present invention is effected while causing DC discharge and RF discharge simultaneously, film formation can be made on the thus surface-treated base material with a good adhesion. Further, an abnormal surface layer formed by electric discharge machining can be readily removed without leaving its corner portion and residual tensile stress introduced by electric discharge machining can also be relieved.

摘要翻译： 公开了一种用于表面处理导电材料的方法，其包括以下步骤：将具有导电材料的基材的DC电极和RF电极放置在反应容器中，使得电极彼此平行; 在所述容器中形成预定气体的减压空间; 同时向DC电极施加直流电压，向RF电极施加射频电力，使得在直流放电和RF放电下对基材的表面进行轰击处理。 由于本发明的表面处理是在同时进行直流放电和RF放电的同时实现的，所以可以在这样表面处理的基材上形成具有良好粘附性的成膜。 此外，通过放电加工形成的异常表面层可以容易地除去而不会留下其角部，并且还可以减轻通过放电加工引入的残余拉伸应力。