公开(公告)号：US07693323B2

公开(公告)日：2010-04-06

申请号：US10097442

申请日：2002-03-12

Applicant: Evgeni Levin ,  Daniel Some ,  Mirta Perlman

Inventor： Evgeni Levin ,  Daniel Some ,  Mirta Perlman

IPC: G06K9/00

CPC classification number: G01N21/95607

Abstract: A method for inspecting a substrate for defects, including: A method for inspecting a substrate for defects, the method including the steps of: (i) obtaining at least two wafer element detection signal; each wafer element detection signal reflects light scattered to a distinct direction; each wafer element detection signal having a wafer element detection value; (ii) calculating at least one wafer element attribute value in response to the at least two wafer element detection signals; retrieving at least one reference wafer element attribute value, each wafer element attribute value corresponding to a reference wafer element attribute value; and (iii) determining a relationship between the at least one reference wafer element attribute value, wafer element attribute value and at least one threshold to indicate a presence of a defect.

Abstract translation: 一种用于检查基板的缺陷的方法，包括：用于检查基板的缺陷的方法，所述方法包括以下步骤：（i）获得至少两个晶片元件检测信号; 每个晶片元件检测信号反射散射到不同方向的光; 每个晶片元件检测信号具有晶片元件检测值; （ii）响应于所述至少两个晶片元件检测信号计算至少一个晶片元件属性值; 检索至少一个参考晶片元件属性值，每个晶片元件属性值对应于参考晶片元件属性值; 以及（iii）确定所述至少一个参考晶片元件属性值，晶片元件属性值和至少一个阈值之间的关系，以指示存在缺陷。