公开(公告)号：US20090009966A1

公开(公告)日：2009-01-08

申请号：US11838904

申请日：2007-08-15

Applicant: HUI YU ,  MU-CHANG WANG

Inventor： HUI YU ,  MU-CHANG WANG

IPC: H05K7/20

CPC classification number: G06F1/20

Abstract: A computer includes a motherboard (2), an enclosure (1), and a fan (153). The motherboard has a first heat generating device (21 ) mounted thereon. The enclosure has a substantially sealed first compartment (10), and an airflow chamber (30) in communication with an exterior of the enclosure. The first compartment receives the first heat generating device therein. The first compartment has a first heat exchanger (3) for conducting heat from an interior of the first compartment to the airflow chamber. The fan is arranged in the airflow chamber.

Abstract translation: 计算机包括主板（2），外壳（1）和风扇（153）。 主板具有安装在其上的第一发热装置（21）。 外壳具有基本上密封的第一隔室（10）和与外壳的外部连通的气流室（30）。 第一隔室在其中容纳第一发热装置。 第一隔室具有用于将热量从第一隔室的内部传导到气流室的第一热交换器（3）。 风扇布置在气流室中。

公开(公告)号：US20060076092A1

公开(公告)日：2006-04-13

申请号：US11224908

申请日：2005-09-13

Applicant: Mu-Chang Wang ,  Ning-Yu Wang

Inventor： Mu-Chang Wang ,  Ning-Yu Wang

IPC: C21D9/52 ,  C21D8/02

CPC classification number: F27B17/0016 ,  F27B17/02 ,  F27D19/00 ,  F27D21/0014

Abstract: A self-adjusting hot box includes a box (1) with a fan, a heater (50) placed in the box (1), a thermostat (30) and a power supply (20) applied to provide power to the fan (12), the thermostat (30) and the heater (50). The heater (50) includes a plurality of heat generating devices, and each of the heat generating devices includes a plurality of power resistors (60) in electrical parallel connection. The thermostat (30) includes a T type thermocouple (33) disposed in the box (1), a double-acting relay (37), a temperature controller (32) and a plurality of single-acting relays. The power supply (20) includes a transformer (21), a bridge clipper diode (23) and a capacitor (25).

Abstract translation: 自调节热箱包括具有风扇的盒子（1），放置在盒子（1）中的加热器（50），恒温器（30）和电源（20），用于向风扇（12）供电 ），恒温器（30）和加热器（50）。 加热器（50）包括多个发热装置，并且每个发热装置包括并联的多个功率电阻（60）。 恒温器（30）包括设置在箱体（1）中的T型热电偶（33），双作用继电器（37），温度控制器（32）和多个单作用继电器。 电源（20）包括变压器（21），桥接钳极二极管（23）和电容器（25）。

公开(公告)号：US07522413B2

公开(公告)日：2009-04-21

申请号：US11842172

申请日：2007-08-21

Applicant: Hui Yu ,  Mu-Chang Wang

Inventor： Hui Yu ,  Mu-Chang Wang

IPC: H05K7/20

CPC classification number: G06F1/20

Abstract: A heat dissipating system comprises a computer enclosure (1), a motherboard (2), at least one dividing panel (271), at least one heat generating element, and at least one heat dissipating device. The computer enclosure has a bottom panel (11). The motherboard is mounted on and substantially parallel to the bottom panel. The at least one dividing panel is perpendicularly attached to the motherboard. The computer enclosure and the at least one dividing panel cooperatively form at least two heat dissipating chambers. The at least one heat generating element is disposed in each of the at least two chambers. The at least one heat dissipating device is disposed in each of the at least two heat dissipating chambers.

Abstract translation: 散热系统包括计算机外壳（1），主板（2），至少一个分隔板（271），至少一个发热元件和至少一个散热装置。 计算机外壳具有底板（11）。 主板安装在底板上并基本上平行于底板。 至少一个分隔板垂直地附接到主板。 计算机外壳和至少一个分隔板协同地形成至少两个散热室。 至少一个发热元件设置在至少两个室中的每一个中。 至少一个散热装置设置在至少两个散热室中的每一个中。

公开(公告)号：US07525802B2

公开(公告)日：2009-04-28

申请号：US11838904

申请日：2007-08-15

Applicant: Hui Yu ,  Mu-Chang Wang

Inventor： Hui Yu ,  Mu-Chang Wang

IPC: H05K7/20 ,  F28F7/00

CPC classification number: G06F1/20

Abstract: A computer includes a motherboard (2), an enclosure (1), and a fan (153). The motherboard has a first heat generating device (21 ) mounted thereon. The enclosure has a substantially sealed first compartment (10), and an airflow chamber (30) in communication with an exterior of the enclosure. The first compartment receives the first heat generating device therein. The first compartment has a first heat exchanger (3) for conducting heat from an interior of the first compartment to the airflow chamber. The fan is arranged in the airflow chamber.

Abstract translation: 计算机包括主板（2），外壳（1）和风扇（153）。 主板具有安装在其上的第一发热装置（21）。 外壳具有基本上密封的第一隔室（10）和与外壳的外部连通的气流室（30）。 第一隔室在其中容纳第一发热装置。 第一隔室具有用于将热量从第一隔室的内部传导到气流室的第一热交换器（3）。 风扇布置在气流室中。

公开(公告)号：US20090016017A1

公开(公告)日：2009-01-15

申请号：US11842172

申请日：2007-08-21

Applicant: HUI YU ,  MU-CHANG WANG

Inventor： HUI YU ,  MU-CHANG WANG

IPC: H05K7/20

CPC classification number: G06F1/20

Abstract: A heat dissipating system comprises a computer enclosure (1), a motherboard (2), at least one dividing panel (271), at least one heat generating element, and at least one heat dissipating device. The computer enclosure has a bottom panel (11). The motherboard is mounted on and substantially parallel to the bottom panel. The at least one dividing panel is perpendicularly attached to the motherboard. The computer enclosure and the at least one dividing panel cooperatively form at least two heat dissipating chambers. The at least one heat generating element is disposed in each of the at least two chambers. The at least one heat dissipating device is disposed in each of the at least two heat dissipating chambers.

Abstract translation: 散热系统包括计算机外壳（1），主板（2），至少一个分隔板（271），至少一个发热元件和至少一个散热装置。 计算机外壳具有底板（11）。 主板安装在底板上并基本上平行于底板。 至少一个分隔板垂直地附接到主板。 计算机外壳和至少一个分隔板协同地形成至少两个散热室。 至少一个发热元件设置在至少两个室中的每一个中。 至少一个散热装置设置在至少两个散热室中的每一个中。