公开(公告)号：US5959011A

公开(公告)日：1999-09-28

申请号：US751254

申请日：1996-11-18

申请人： Fumio Mizuno ,  Noburu Moriuchi ,  Seiichiro Shirai ,  Yutaka Moroishi ,  Makoto Sunakawa ,  Michirou Kawanishi

发明人： Fumio Mizuno ,  Noburu Moriuchi ,  Seiichiro Shirai ,  Yutaka Moroishi ,  Makoto Sunakawa ,  Michirou Kawanishi

IPC分类号： B29C63/00 ,  G03F7/34 ,  G03F7/42 ,  C08K5/09

CPC分类号： B29C63/0013 ,  G03F7/343 ,  G03F7/42 ,  Y10S156/922 ,  Y10T156/11 ,  Y10T156/1189

摘要： A method for removing a resist pattern formed on a semiconductor wafer, and a curable pressure-sensitive adhesive, adhesive sheets and an apparatus used for the method. The resist-removing method comprising adhering an adhesive tape on an upper surface of a resist pattern formed on an article and peeling off the resist pattern together with the adhesive tape; the curable pressure-sensitive adhesive constituting the adhesive tape, comprising a pressure-sensitive adhesive polymer containing a non-volatile compound having at least one unsaturated double bond in the molecule and having a good affinity with a resist material to be removed; the adhesive sheet comprising a film substrate having formed thereon the curable pressure-sensitive adhesive; and the resist-removing apparatus comprising a means for press-adhering the adhesive tape, a tape-peeling means, and a substrate-washing means.