Abstract:
A model generation method for generating a semiconductor device model used for power supply noise analysis, is performed by, calculating noise values for various circuit elements based on current source noise waveforms calculated in accordance with a current flowing from a power supply when a state of the elements changes, determining the time when the change of state of the elements causing the current source noise occurs in relation to successive timing windows each having a predetermined time width, and calculating noise by unit time and adding up for each divided unit time the noise value calculated for all elements whose timing window is present in the unit time, wherein a timing determination unit determines the worst case and other noise generation timing based on the noise generated in each unit time.
Abstract:
A design data dependency managing apparatus comprises an input/output data storing unit for storing design input/output dependency information indicating a dependency between design input/output data, which becomes an input/output of a design, and other design input/output data in association with the design input/output data, and a design execution environment constructing unit for generating design data dependency information indicating a version number, on which a dependency is made, of the design input/output data required for the design by using the design input/output dependency information, and for constructing a design execution environment.
Abstract:
A design data dependency managing apparatus comprises an input/output data storing unit for storing design input/output dependency information indicating a dependency between design input/output data, which becomes an input/output of a design, and other design input/output data in association with the design input/output data, and a design execution environment constructing unit for generating design data dependency information indicating a version number, on which a dependency is made, of the design input/output data required for the design by using the design input/output dependency information, and for constructing a design execution environment.
Abstract:
A model generation method for generating a semiconductor device model used for power supply noise analysis, is performed by, calculating noise values for various circuit elements based on current source noise waveforms calculated in accordance with a current flowing from a power supply when a state of the elements changes, determining the time when the change of state of the elements causing the current source noise occurs in relation to successive timing windows each having a predetermined time width, and calculating noise by unit time and adding up for each divided unit time the noise value calculated for all elements whose timing window is present in the unit time, wherein a timing determination unit determines the worst case and other noise generation timing based on the noise generated in each unit time.
Abstract:
The invention comprises the steps of storing immersed or smothered raw material of soy beans including hulls in a storage chamber provided at the front part of a cylinder barrel, subsequently passing the stored raw material of soybeans through screens furnished at the front end of the cylinder barrel by driving a piston, and urging to press it out, thereby to manufacture a milk of the soy beans of the raw material being extremely refined. At this time, the screens are 60 to 500 meshes, and the pressure is 8.0 to 55.0 MPa.
Abstract:
Extruded elongate pasta is disclosed, each pasta strand having at least one groove formed longitudinally in the pasta strand in such a manner that the total cross sectional area of the groove is 2 to 25% of the cross sectional area of the pasta strand, and the groove in the pasta strand is substantially closed after the elongate pasta is boiled or dipped in hot water. A die structure for extruding the elongate pasta is also disclosed, the die structure being so arranged that a projection is projected toward the axis of a die hole from the inner surface of the die hole and that the coefficient of friction of the inner surface of the die hole is 0.4 or less. It is preferable that a tapered portion is formed on the upstream end of the projection. Further, an extruder for forming the elongate pastas which has a number of such die holes is also disclosed, in which projections of the die holes are projected perpendicularly to the aligning direction of the die holes.
Abstract:
Extruded elongate pasta is disclosed, each pasta strand having at least one groove formed longitudinally in the pasta strand in such a manner that the total cross sectional area of the groove is 2 to 25% of the cross sectional area of the pasta strand, and the groove in the pasta strand is substantially closed after the elongate pasta is boiled or dipped in hot water.