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公开(公告)号:US20070021582A1
公开(公告)日:2007-01-25
申请号:US11491118
申请日:2006-07-24
申请人: Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
发明人: Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
CPC分类号: C08G59/686 , C08G59/18 , C08G59/66
摘要: The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.
摘要翻译: 本申请涉及含有环氧树脂的单组分环氧树脂组合物,其包含:(1)分子中具有2个以上环氧基的环氧树脂,(2)分子中具有2个以上硫醇基的多硫醇化合物 ,(3)在固化温度条件下释放碱性成分并溶解于成分(2)中的化合物,(4)具有路易斯酸性的化合物。 本发明还涉及其制备方法。
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公开(公告)号:US07479534B2
公开(公告)日:2009-01-20
申请号:US11491118
申请日:2006-07-24
申请人: Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
发明人: Hiroshi Amano , Osamu Yamabe , Hiroyasu Koto
IPC分类号: C08G59/66
CPC分类号: C08G59/686 , C08G59/18 , C08G59/66
摘要: The present application relates to a one-component epoxy resin composition that contains an epoxy resin containing: (1) an epoxy resin having 2 or more epoxy groups in the molecule, (2) a polythiol compound having 2 or more thiol groups in the molecule, (3) a compound that releases a basic component under a curing temperature condition and dissolves in constituent (2), and (4) a compound having Lewis acidity. The present invention also relates to a method of producing the same.
摘要翻译: 本申请涉及含有环氧树脂的单组分环氧树脂组合物,其包含:(1)分子中具有2个以上环氧基的环氧树脂,(2)分子中具有2个以上硫醇基的多硫醇化合物 ,(3)在固化温度条件下释放碱性成分并溶解于成分(2)中的化合物,(4)具有路易斯酸性的化合物。 本发明还涉及其制备方法。
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