Apparatus for applying a liquid coating with an improved spray nozzle
    1.
    发明授权
    Apparatus for applying a liquid coating with an improved spray nozzle 失效
    用改进的喷嘴施加液体涂层的装置

    公开(公告)号:US06325853B1

    公开(公告)日:2001-12-04

    申请号:US08878756

    申请日:1997-06-19

    IPC分类号: B05C500

    摘要: Apparatus and methods for spray coating selected areas of a circuit board with a liquid coating material without coating regions of the circuit board to be left uncoated. In one mode of operation, a bead of liquid coating material dispensed from an elongated nozzle tip is atomized by directing jets of air pressurized against the bead to form a conical, swirling spray pattern which is sprayed on selected areas of a circuit board. In a second mode of operation, the non-atomized bead of liquid coating material dispensed through the elongated nozzle tip is applied on selected areas of the circuit board. In a third mode of operation, jets of pressurized air are directed against the bead of liquid coating material to create a soft swirl pattern, without atomizing the bead of coating material. In a second embodiment of the invention, the bead of liquid coating material is dispensed from a nozzle without the elongated nozzle tip.

    摘要翻译: 用液体涂覆材料喷涂电路板的选定区域的装置和方法,而不涂覆电路板的未被涂覆的区域。 在一种操作模式中,从细长的喷嘴尖端分配的液体涂层材料的珠子通过将喷射的空气引导到凸缘上而被雾化,以形成喷射在电路板的选定区域上的圆锥形的旋转喷雾图案。 在第二操作模式中,通过细长喷嘴尖端分配的液体涂覆材料的非雾化珠被施加在电路板的选定区域上。 在第三种操作模式中,加压空气的喷嘴被引导到液体涂覆材料的珠粒上以产生柔软的漩涡图案,而不会使涂层材料的珠粒雾化。 在本发明的第二实施例中,液体涂层材料的珠粒从喷嘴分配而没有细长的喷嘴尖端。