Wafer
    1.
    发明授权
    Wafer 有权
    晶圆

    公开(公告)号:US08613966B2

    公开(公告)日:2013-12-24

    申请号:US10541302

    申请日:2004-01-07

    IPC分类号: A21D13/00

    CPC分类号: A21C15/025

    摘要: A rippled wafer (90) formed of a convoluted wafer ribbon (80), the rippled wafer (90) having an average of at least 12 turns/cm2, wherein a turn is a change in direction of the wafer ribbon (80) of at least 45°, and a confectionery product comprising such a wafer. Also a confectionery product comprising a rippled wafer (90) formed of a convoluted wafer ribbon (80), wherein the turns are substantially uniformly distributed across the cross section of the rippled wafer, where a turn is a change in direction of the wafer ribbon of at least 45°, and a confectionery product comprising a three-dimensional rippled wafer (90) formed in a single step.

    摘要翻译: 波纹晶片(90)由卷积晶片带(80)形成,波纹晶片(90)具有至少12匝/平方厘米的平均值,其中匝是晶片带(80)的方向上的变化 至少45°,以及包含这种晶片的糖果产品。 还包括由旋转晶片带(80)形成的波纹晶片(90)的糖果产品,其中匝基本均匀地分布在波纹晶片的横截面上,其中匝是晶片带的方向改变 至少45°,以及包括在单个步骤中形成的三维波纹晶片(90)的糖果产品。