Low-stress internal structure for optoelectronic housing
    1.
    发明授权
    Low-stress internal structure for optoelectronic housing 有权
    光电子室内低应力内部结构

    公开(公告)号:US06736554B2

    公开(公告)日:2004-05-18

    申请号:US10130700

    申请日:2002-05-22

    IPC分类号: G02B636

    CPC分类号: G02B6/421 G02B6/4239

    摘要: In an optoelectronic module (1) comprising a plastics material package (2) accommodating a base (8) fixed to the package (2) and supporting an optical component (9) coupled by an optical fiber (5) to an optical connector (4) of the package (2), fiber displacements associated with thermal stresses are avoided by mounting the base so that it floats on the package (2) and possibly the connector (4). The floating mounting of the base (8) is obtained by using for fixing the base one or more adhesives (13, 14) having a greater elasticity than the adhesives used to fix each of the two ends (6, 7) of the fiber (5) to the base (8) and the connector (4), respectively.

    摘要翻译: 一种光电子模块(1),包括一个容纳固定到封装(2)上的基座(8)的塑料材料封装(2),并支撑由光纤(5)耦合到光学连接器(4)的光学部件 ),通过安装基座使其浮在包装(2)上以及可能的连接器(4)上来避免与热应力相关的纤维位移。 基底(8)的浮动安装通过用于固定基底一个或多个具有比用于固定纤维的两个端部(6,7)中的每一个的粘合剂的弹性大的粘合剂(13,14)来获得( 5)分别连接到基座(8)和连接器(4)。