Housing structure with multiple sealing layers
    1.
    发明授权
    Housing structure with multiple sealing layers 有权
    具有多个密封层的外壳结构

    公开(公告)号:US06717052B2

    公开(公告)日:2004-04-06

    申请号:US10157933

    申请日:2002-05-31

    IPC分类号: H05K506

    摘要: A housing structure used for a display device. A transparent substrate is provided with a completed luminescent device. The rim of the transparent substrate is bonded to the rim of a sealing cap to form an airtight space. A sealing structure with a first sealing layer and a second sealing layer is provided on the bonding rim between the sealing cap and the transparent substrate. The materials used to form the first sealing layer and the second sealing layer are different.

    摘要翻译: 用于显示装置的外壳结构。 透明基板设置有完整的发光装置。 透明基板的边缘与密封盖的边缘接合以形成气密的空间。 在密封盖和透明基板之间的接合边缘上设置有具有第一密封层和第二密封层的密封结构。 用于形成第一密封层和第二密封层的材料是不同的。

    Method for forming a thin film light emitting device
    2.
    发明授权
    Method for forming a thin film light emitting device 失效
    用于形成薄膜发光器件的方法

    公开(公告)号:US06984546B2

    公开(公告)日:2006-01-10

    申请号:US09849457

    申请日:2001-05-04

    IPC分类号: H01L21/44 H01L21/48 H01L21/50

    摘要: A method is to form a thin film light emitting device. The method includes providing a transparent substrate. A transparent anode layer, a light emitting layer, a metal cathode layer are sequentially formed on the transparent substrate. A sealant layer is formed to at least cover the light emitting layer and the metal cathode layer. A covering layer having a covering surface is provided. An evaporation process is performed to form an active absorption layer on the covering surface of the covering layer. The covering surface of the covering layer covers on a portion of the sealant layer above the metal cathode layer. The covering layer can have a recess region that is to be formed the active absorption layer thereon. Alternatively, the active absorption layer can be evaporated before the sealant is formed. Moreover, the active absorption layer can be replaced with an insulating layer.

    摘要翻译: 一种方法是形成薄膜发光器件。 该方法包括提供透明基板。 在透明基板上依次形成透明阳极层,发光层,金属阴极层。 形成密封剂层以至少覆盖发光层和金属阴极层。 提供具有覆盖面的覆盖层。 进行蒸发处理以在覆盖层的覆盖表面上形成活性吸收层。 覆盖层的覆盖表面覆盖在金属阴极层上方的密封剂层的一部分上。 覆盖层可以具有在其上形成有效吸收层的凹部区域。 或者,可以在形成密封剂之前蒸发活性吸收层。 此外,可以用绝缘层代替有源吸收层。

    Packaging structure for a display device
    3.
    发明授权
    Packaging structure for a display device 失效
    显示设备的包装结构

    公开(公告)号:US06724143B2

    公开(公告)日:2004-04-20

    申请号:US10153794

    申请日:2002-05-24

    IPC分类号: H05B3304

    CPC分类号: H01L51/5246

    摘要: A packaging structure for an OLED/PLED device. The packaging structure has a glass substrate on which a luminescent element is completed, and a sealing cap bonded to the rim of the glass substrate so as to seal the luminescent element within an airtight space. Also, a sealing agent is disposed between the rims of the sealing cap and the glass substrate, wherein the sealing agent is an alloy with a low eutectic point about 100˜300° C.

    摘要翻译: 用于OLED / PLED器件的封装结构。 封装结构具有完成了发光元件的玻璃基板和与玻璃基板的边缘接合以将发光元件密封在气密空间内的密封帽。 此外,密封剂设置在密封盖和玻璃基板的边缘之间,其中密封剂是低共晶点在约100〜300℃的合金。